Two-Phase Cooling Head Structure for High-Heat CPU and GPU Loads
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Solution Overview
Problem
Traditional air-cooled and water-cooled heat dissipation methods struggle to efficiently dissipate large amounts of heat generated by electronic devices like CPUs and GPUs, leading to overheating and reduced thermal conductivity efficiency over time.
Innovation Solution
A liquid cooling device with a two-phase cooling component that includes a water cooling head, a heat dissipation module, and a two-phase cooling component, where a working fluid inside the evaporation section vaporizes, transfers heat to a condensation section, and condenses back into a liquid state to complete a thermal cycle, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional air-cooled heat dissipation method is used, then the structure is simple, but the heat dissipation efficiency is insufficient for large amounts of heat
Solution Approach 1:
The patent introduces a two-phase cooling component as an intermediary between the heat source and heat sink. This component includes an evaporation section that contacts the heat source and a condensation section that contacts the heat sink, with a working fluid inside that absorbs heat through vaporization and releases heat through condensation, thereby significantly improving heat dissipation efficiency while maintaining structural simplicity
Solution Approach 2:
The patent utilizes phase transitions of the working fluid within the two-phase cooling component. The working fluid evaporates in the evaporation section (absorbing latent heat) and condenses in the condensation section (releasing latent heat), creating a highly efficient thermal cycle that resolves the contradiction between structural simplicity and heat dissipation efficiency
2Productivity
If water cooling method is used, then the heat dissipation efficiency is improved, but the water cooling head shell temperature rises leading to decreased thermal conductivity efficiency
Solution Approach 1:
The two-phase cooling component acts as an intermediary between the heat source and the water cooling head shell. The evaporation section absorbs heat directly from the heat source, preventing heat accumulation in the water cooling head shell, thus maintaining lower shell temperature and sustained thermal conductivity efficiency
Solution Approach 2:
The working fluid undergoes phase transition from liquid to vapor in the evaporation section, absorbing large amounts of latent heat directly at the heat source interface. This prevents heat buildup in the water cooling head shell, maintaining its temperature lower and preserving its thermal conductivity efficiency over time
3Productivity
If two-phase cooling component is added, then the heat dissipation efficiency is improved, but the device complexity increases
Solution Approach 1:
The patent merges the two-phase cooling component with the existing water cooling head structure. The evaporation section is integrated into the water cooling head, and the condensation section is integrated with the heat sink, combining multiple cooling functions into a unified system that improves heat dissipation without proportionally increasing complexity
Solution Approach 2:
The two-phase cooling component serves multiple functions: it acts as a heat absorber at the evaporation section, a heat transfer medium through the working fluid phase change, and a heat releaser at the condensation section. This multi-functionality allows a single component to perform multiple cooling tasks, improving heat dissipation efficiency while minimizing the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The two-phase cooling system effectively reduces the temperature of the water cooling head, improving heat dissipation efficiency by continuously transferring heat away from the heat source through a thermal cycle.
Implementation Method 1
The water cooling head absorbs heat from the heat source via the base plate and conducts the heat to the water cooling shell, and the heat is then conducted to the evaporation section
Implementation Method 2
A working fluid inside the evaporation section is heated and vaporized
Implementation Method 3
A working fluid inside the evaporation section is heated and vaporized, flows to the condensation section, transfers the heat to the heat sink set, condenses back into a liquid state
Implementation Method 4
flows to the condensation section, transfers the heat to the heat sink set
Implementation Method 5
condenses back into a liquid state and returns to the evaporation section to complete a thermal cycle
Data Source
AI summary
A liquid cooling device including a water cooling head, a heat dissipation module, and a two-phase cooling component. The water cooling head includes a base plate and a water cooling shell. An accommodating slot is defined on the water cooling shell. The heat dissipation module includes a heat sink set and a supporting plate. A perforation is defined on the heat sink set. The heat sink set is positioned on the water cooling head. The two-phase cooling component includes an evaporation section and a condensation section. The evaporation section is positioned in the accommodating slot, and the condensation section passes through the perforation. Therefore, the heat dissipation efficiency of the liquid cooling system is improved.