Two-Phase Electronic Component Cooling with Wicking Material
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Solution Overview
Problem
High power dissipation in electronic components, such as motor controllers, necessitates innovative thermal management to prevent overheating, as conventional cooling methods are inefficient and often require heavy, expensive housing structures and potting compounds.
Innovation Solution
A two-phase fluid cooling system is implemented within an electronic component assembly, utilizing a cavity filled with a fluorocarbon liquid and vapor, along with a wicking material to absorb and recycle the liquid phase, eliminating the need for external circulation and minimizing the use of potting material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods are used, then electronic components can be cooled, but the housing structure becomes heavy and expensive
Solution Approach 1:
The patent utilizes phase transition of the cooling fluid (liquid to vapor and back to liquid) to transfer heat from the electronic component. The fluid absorbs heat by evaporating at the hot surface and releases heat by condensing elsewhere, providing efficient cooling without requiring heavy housing structures or potting compounds.
Solution Approach 2:
The wicking material automatically returns the condensed liquid phase back to the electronic component surface through capillary action, eliminating the need for external pumps or circulation systems. This self-service mechanism reduces system complexity and weight while maintaining effective cooling.
2Temperature
If conventional cooling methods are used, then electronic components can be cooled, but the use of potting material increases weight and cost
Solution Approach 1:
The two-phase cooling fluid provides superior heat transfer efficiency through phase change, eliminating the need for excessive potting material that would otherwise be required to conduct heat away from the component. The phase transition mechanism achieves effective thermal management with minimal material usage.
Solution Approach 2:
The patent extracts the cooling function from the potting material and implements it through a dedicated two-phase cooling system. This separation allows the potting material to be minimized or eliminated entirely, reducing weight and cost while maintaining cooling effectiveness.
3Loss of energy
If high power dissipation is managed with conventional methods, then heat can be dissipated, but the housing structure becomes complex and expensive
Solution Approach 1:
The two-phase cooling system handles high power dissipation through efficient phase change heat transfer, achieving superior heat dissipation compared to conventional single-phase cooling. This eliminates the need for complex heat sinks, thermal vias, or active cooling systems, thereby reducing overall device complexity.
Solution Approach 2:
The wicking material's capillary action automatically circulates the cooling fluid without external pumps or controls, providing a simple yet effective solution for high power dissipation management. This self-service mechanism reduces system complexity while maintaining high heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat without the need for extensive potting material, reducing weight and cost while maintaining safe temperature limits for electronic components.
Implementation Method 1
A wicking material is arranged in the cavity between the housing and the electronic element. The cavity provides a gap adjacent to the wicking material. The wicking material is configured to absorb the liquid phase
Implementation Method 2
a cavity filled with a cooling fluid that has a liquid phase and a vapor phase
Data Source
Figure 1~3
Figure 2A~4
AI summary
An electronic component assembly includes a housing, 28, that provides a cavity, 34, filled with a cooling fluid that has a liquid phase and a vapor phase. An electronic element, 20, is arranged in the cavity, 34, and is configured to generate heat. A wicking material, 42, is arranged in the cavity, 34, between the housing, 28, and the electronic element, 20. The cavity, 34, provides a gap, 43, adjacent to the wicking material, 42. The wicking material, 42, is configured to absorb the liquid phase, and the vapor phase is arranged in the gap, 43.