Two-Phase Cooling with Ambient Condenser for High Heat Flux Processors
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Solution Overview
Problem
Current cooling methods are inadequate for microprocessors with high heat flux and 3D chip stacks, as they fail to efficiently manage thermal resistance and energy consumption.
Innovation Solution
A two-phase cooling system with a primary and secondary loop, utilizing an evaporator, ambient cooled condenser, pumps, pressure regulators, and a controller to dynamically adjust coolant flow and pressure based on ambient conditions, along with a heat recovery system, to minimize energy consumption and thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air-cooled systems are used, then device complexity is reduced, but thermal resistance and energy usage increase significantly
Solution Approach 1:
The patent employs two-phase cooling where the coolant transitions between liquid and vapor phases. The coolant evaporates at the evaporator to absorb heat from high heat density components, then condenses at the condenser to release heat to the ambient environment. This phase change mechanism enables highly efficient heat transfer with thermal resistance reductions up to 20 times compared to air-cooled systems, while maintaining reasonable energy consumption through passive heat dissipation to ambient air.
2Temperature
If two-phase cooling systems are implemented, then cooling efficiency for high heat flux components improves, but device complexity increases
Solution Approach 1:
The cooling system is divided into two separate loops: a primary two-phase cooling loop for high heat density components and a secondary single-phase cooling loop for lower heat density components. The primary loop handles evaporative cooling of critical components, while the secondary loop manages condensation and ambient heat rejection. This segmentation allows each loop to be optimized for its specific function, managing overall system complexity while achieving superior cooling efficiency for high heat flux applications.
Solution Approach 2:
The patent introduces a heat exchanger as an intermediary component between the primary and secondary cooling loops. The heat exchanger transfers heat from the vaporized coolant in the primary loop to the secondary coolant, enabling the two-phase cooling process without direct exposure of high heat density components to the ambient environment. This intermediary approach simplifies the overall system architecture while maintaining high cooling efficiency.
3Adaptability or versatility
If dynamic adjustment of pump and pressure regulator is implemented, then adaptability to ambient conditions improves, but device complexity increases
Solution Approach 1:
The controller receives feedback from temperature sensors and pressure sensors that monitor ambient conditions and system state. Based on this feedback, the controller dynamically adjusts the pump speed and pressure regulator settings to optimize cooling performance for varying ambient temperatures and heat loads. This feedback mechanism enables the system to adapt to changing conditions automatically, maintaining optimal thermal management without requiring complex manual intervention.
Solution Approach 2:
The system employs dynamic control where the pump and pressure regulator can adjust their operating parameters in real-time based on ambient conditions and thermal load requirements. The pump speed varies to match cooling demand, and the pressure regulator dynamically adjusts system pressure to optimize the boiling point and heat transfer characteristics of the coolant. This dynamic operation allows the system to efficiently handle varying ambient temperatures and heat generation rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thermal resistance and energy usage by up to 20 times compared to air-cooled systems, enabling efficient cooling of high heat density components and year-round data center cooling without energy-intensive systems.
Implementation Method 1
the evaporator cools high heat density components of the computer system by evaporation of the liquid coolant into a vaporized coolant
Implementation Method 2
the ambient cooled condenser transfers heat released by condensation of the vaporized coolant to a secondary coolant in a secondary coolant loop
Implementation Method 3
a cooler that exchanges heat with an ambient external environment
Data Source
AI summary
An apparatus for cooling a computer system includes a primary cooling loop. The primary cooling loop includes an evaporator configured to cool at least a component of the computer system, an ambient cooled condenser connected to the evaporator, a first pump to provide a coolant flow within the cooling loop, a pressure regulator configured to maintain a selected pressure in the primary cooling loop, and a controller responsive to changes in outdoor ambient conditions and an amount of heat dissipated by the computer system and configured to dynamically adjust the pump and pressure regulator in response thereto.