Two-Phase Flow Nozzle for Wafer Cleaning
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Solution Overview
Problem
Conventional semiconductor cleaning technologies face challenges in effectively removing contaminants of smaller sizes due to damage from atomized particles and inefficient liquid utilization, incomplete drying leading to watermark defects, and inadequate cleaning of wafer edges, resulting in reduced manufacturing yield and surface damage.
Innovation Solution
A cleaning device utilizing a nozzle with liquid and gas guiding outlets to form ultra-micro atomized particles, combined with ultrasonic or megasonic energy and gas shielding, enables precise control over particle size and direction, improving cleaning efficiency and reducing damage to wafer patterns, while also ensuring complete drying and edge cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional atomization cleaning is used to remove contaminants, then cleaning effectiveness is improved, but liquid particles cause damage to surface patterns
Solution Approach 1:
The patent changes the physical parameters of the cleaning liquid by atomizing it into ultra-micro particles with controlled size distribution. This parameter change allows the liquid to effectively remove contaminants while reducing the kinetic energy and impact damage to surface patterns, resolving the contradiction between cleaning effectiveness and pattern damage.
Solution Approach 2:
The cleaning liquid is segmented into numerous ultra-micro atomized particles through specialized nozzles. This segmentation increases the surface area and distribution of the liquid, improving cleaning effectiveness while each individual particle has reduced energy, thereby minimizing pattern damage.
2Device complexity
If conventional cleaning devices are used, then simple structure is maintained, but liquid flow utilization is low causing resource waste
Solution Approach 1:
The patent incorporates feedback mechanisms through pressure sensors and flow controllers that monitor and adjust the atomized liquid flow in real-time. This feedback system optimizes liquid utilization efficiency, ensuring that cleaning is achieved with minimal liquid consumption while maintaining effective cleaning performance.
Solution Approach 2:
The patent changes the flow parameters of the cleaning liquid through precise control of atomization pressure and nozzle design. This allows for optimized liquid distribution and utilization, reducing waste while maintaining cleaning effectiveness, thereby resolving the contradiction between structural simplicity and resource efficiency.
3Ease of operation
If conventional spray methods are used, then easy operation is maintained, but incomplete drying causes watermark defects
Solution Approach 1:
The patent employs periodic action through ultrasonic or megasonic vibration applied during the drying phase. This periodic vibration prevents water droplet coalescence and promotes complete evaporation, eliminating watermark defects while maintaining ease of operation through automated process control.
Solution Approach 2:
The patent utilizes phase transition principles by controlling the evaporation process through controlled heating and ultrasonic vibration. This ensures complete drying of the wafer surface by promoting uniform phase transition from liquid to vapor, preventing watermark formation while maintaining operational simplicity.
4Device complexity
If conventional cleaning approaches are used, then process simplicity is maintained, but micro particles cannot be effectively removed due to static boundary layer
Solution Approach 1:
The patent applies mechanical vibration in the form of ultrasonic or megasonic waves to the cleaning liquid and wafer surface. This vibration disrupts the static boundary layer, enhancing the removal of micro particles that would otherwise be trapped, thereby improving productivity without significantly complicating the overall process.
Solution Approach 2:
The patent changes the dynamic parameters of the cleaning liquid by introducing ultrasonic or megasonic vibration. This parameter change transforms the static boundary layer into a dynamic, turbulent flow that effectively removes micro particles, resolving the contradiction between process simplicity and micro particle removal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves enhanced cleaning quality and efficiency, reduces pattern damage, and improves manufacturing yield by forming uniform, ultra-micro atomized particles with controlled energy, ensuring complete drying and effective edge cleaning.
Implementation Method 1
a liquid sprayed from a plurality of liquid guiding outlets and a gas sprayed from a plurality of gas guiding outlets collide against each other below the liquid-gas guiding part to form atomized particles
Implementation Method 2
an ultrasonic or megasonic generation unit provided along an inner surface of the liquid pipe to generate ultrasonic or megasonic vibration
Implementation Method 3
the atomized particles produce an impact force to the liquid membrane on the wafer surface and form a shock wave spreading rapidly in the liquid membrane
Implementation Method 4
a gas shielding unit surrounding a lower end of the nozzle to form a gas shielding layer
Data Source
AI summary
A cleaning device for atomizing and spraying liquid in two-phase flow comprising a nozzle provided with multiple liquid bypass pipelines each having liquid guiding outlets inclined at a predetermined angle and an exhaust mesh plate having vertical gas guiding outlets, which makes the high speed liquid flow and high speed gas flow sprayed out therefrom collide against each other sufficiently to form ultra-micro atomized particles with uniform and adjustable size. The ultra-micro atomized particles are sprayed out downwardly to the wafer surface under the acceleration and vertical orientation effects of an atomized particle guiding outlet to perform a reciprocating cleaning for the wafer. Other components such as an ultrasonic or megasonic generation unit, a gas shielding unit, a self-cleaning unit or a rotating unit can also be provided to perform the multifunction of the nozzle.