Two-Phase Jet-Impingement Heat Sinks for High-Heat-Flux Electronics
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Solution Overview
Problem
Current cooling systems for electronic devices, such as microprocessors, are inefficient and unable to handle the high heat fluxes of next-generation components, leading to increased energy consumption, noise, and mechanical stress, with air-cooled systems being particularly ineffective and liquid-cooled systems facing limitations in thermal resistance and adaptability.
Innovation Solution
A cooling apparatus utilizing a two-phase flow system with heat sink modules that direct jet streams of coolant against the heat source, transitioning from single-phase liquid to two-phase bubbly flow to enhance heat transfer rates, and featuring flexible connections and modular design for efficient cooling of high heat flux devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional air-cooling systems are used to cool microprocessors, then cooling capacity is provided, but the systems become large, noisy, and consume excessive power
Solution Approach 1:
The patent transitions from air-cooling to liquid-cooling systems, using pumps to circulate dielectric coolant through channels in the heat sink module. This hydraulic approach enables more efficient heat removal with lower power consumption compared to the pneumatic fan-based air cooling systems.
Solution Approach 2:
The patent utilizes two-phase flow (liquid-vapor transition) of dielectric coolant through the heat sink module. The coolant absorbs heat through evaporation and condenses back to liquid, providing high heat transfer coefficients that enable effective cooling with compact, low-power systems.
2Temperature
If high air flow rates are used to cool high heat flux devices, then cooling effectiveness improves, but system size and power consumption increase dramatically
Solution Approach 1:
The patent uses liquid coolant circulation through pumped hydraulic systems instead of high-volume air flow. The liquid phase enables much higher heat capacity and heat transfer coefficients, achieving the same cooling effect in a compact volume without requiring large fans or air movement systems.
Solution Approach 2:
The patent changes the thermal properties of the cooling medium from gas (air) to liquid (dielectric coolant), and further to two-phase liquid-vapor mixture. This parameter change increases the volumetric heat capacity and heat transfer coefficient by orders of magnitude, enabling compact system design.
3Temperature
If metallic heat sinks are used to cool microprocessors, then heat transfer is improved, but mechanical stress and fatigue damage to the microprocessor increase
Solution Approach 1:
The patent employs a compliant polymer heat sink module that can flex and conform to the microprocessor surface. This flexibility eliminates rigid mechanical stress and fatigue damage while maintaining effective thermal contact, unlike traditional rigid metallic heat sinks.
Solution Approach 2:
The heat sink module uses composite construction with polymer materials that provide both thermal conductivity and mechanical compliance. This composite approach balances heat transfer performance with structural gentleness to protect the microprocessor.
4Temperature
If liquid-cooling systems are implemented to improve cooling efficiency, then heat transfer rates increase, but thermal resistance and adaptability limitations remain
Solution Approach 1:
The heat sink module is segmented into multiple independent flow channels that can be individually configured. This segmentation allows the system to adapt to localized hot spots by directing coolant flow where needed, improving versatility while maintaining high heat transfer rates.
Solution Approach 2:
The patent implements dynamic flow distribution in the heat sink module, where coolant flow can be adjusted or redirected based on thermal conditions. This dynamic capability enables adaptation to varying heat loads and hot spot locations, overcoming the static limitations of traditional liquid cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling apparatus achieves significantly higher heat transfer rates than traditional systems, reducing energy consumption, noise, and mechanical stress, while allowing for efficient cooling of local hot spots and scalable implementation in data centers and electronic devices.
Implementation Method 1
A cooling apparatus utilizing a two-phase flow system with heat sink modules that direct jet streams of coolant against the heat source, transitioning from single-phase liquid to two-phase bubbly flow to enhance heat transfer rates
Implementation Method 2
heat sink modules that direct jet streams of coolant against the heat source
Implementation Method 3
transitioning from single-phase liquid to two-phase bubbly flow
Implementation Method 4
The cooling apparatus achieves significantly higher heat transfer rates than traditional systems
Data Source
AI summary
A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface. The heat sink module can include a dividing member disposed between the inlet chamber and the outlet chamber. The dividing member can include a first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.