Two-Phase IC Package Lid for Heat Dissipation and Warpage Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
State-of-the-art mobile application devices face overheating issues due to multiple heat sources within a small form factor, necessitating improved thermal management solutions.
Innovation Solution
Integration of a two-phase thermal management device, such as a vapor chamber or heat pipes, embedded in a mold compound within the packaged integrated circuit device, which includes a semiconductor die and a lid thermally coupled to the die, along with an interface layer, to enhance thermal distribution and resistance to warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple heat sources are arranged within a small form factor to increase device functionality, then device performance and processing capability are improved, but thermal management becomes more difficult and overheating occurs
Solution Approach 1:
The thermal management system is segmented into multiple independent heat pipes, each targeting specific heat sources (CPU, GPU, NPU) within the semiconductor die. This segmentation allows targeted heat removal from different regions, effectively managing thermal loads from multiple heat sources without compromising processing capability
Solution Approach 2:
Heat pipes serve as intermediary thermal conduction elements between the semiconductor die heat sources and the heat sink. These intermediaries efficiently transfer heat from concentrated sources to distributed dissipation areas, resolving the thermal management challenge while maintaining high processing performance
2Temperature
If a lid is added to the packaged integrated circuit device to provide thermal management, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The lid is designed to perform multiple functions simultaneously: it provides structural protection for the semiconductor die, serves as a mounting platform for heat pipes, acts as a thermal conduction path to the heat sink, and contributes to overall device sealing. This multi-functionality improves heat dissipation without proportionally increasing device complexity
Solution Approach 2:
The lid structure is merged with the thermal management system by integrating heat pipe attachments directly onto the lid. This combination eliminates the need for separate thermal management components, achieving effective heat dissipation while minimizing additional structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal distribution and heat dissipation, along with structural support to mitigate overheating and warpage, enhancing the performance of integrated circuit devices.
Implementation Method 1
The working fluid in the two-phase thermal management device undergoes a phase change from a liquid state to a vapor state when it receives heat from the semiconductor die
Implementation Method 2
Integration of a two-phase thermal management device, such as a vapor chamber or heat pipes, embedded in a mold compound within the packaged integrated circuit device
Implementation Method 3
a lid thermally coupled to the semiconductor die via an interface layer positioned between the semiconductor die and the two-phase thermal management device
Data Source
AI summary
Various aspects of the present disclosure generally relate to an integrated circuit device, such as a packaged integrated circuit device. In some aspects, an integrated circuit device includes a semiconductor die and a lid thermally coupled to the semiconductor die. The lid includes a two-phase thermal management device. The integrated circuit device also includes an interface layer in contact with the semiconductor die and the lid.