Two-Phase Refrigeration System for Unified DUT Cooling and Heating
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Solution Overview
Problem
Conventional semiconductor device testing systems require separate heating and cooling systems, which counteract each other and are inefficient, leading to a need for improved techniques to manage thermal cycles during testing.
Innovation Solution
A two-phase thermal system incorporating a compressor, condenser, evaporator, and control valves to regulate refrigerant flow for both cooling and heating, allowing for simultaneous thermal control of devices under test by utilizing refrigerant liquid for cooling and hot gas for heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate heating and cooling systems are used for DUT testing, then both heating and cooling functions can be provided, but the systems counteract each other and reduce thermal control efficiency
Solution Approach 1:
The patent combines separate heating and cooling systems into a unified two-phase refrigeration system. The refrigeration cycle components (compressor, condenser, expansion device, evaporator) serve dual purposes: cooling mode uses the evaporator to absorb heat from DUT, while heating mode redirects refrigerant flow to transfer heat from condenser to DUT through a heat exchange medium, eliminating system counteraction and improving thermal control efficiency
Solution Approach 2:
The refrigeration system is designed with multi-functionality to perform both heating and cooling operations. By controlling refrigerant flow direction and using the heat exchanger medium, the same system components provide either cooling (evaporator absorbing heat) or heating (condenser transferring heat to medium that contacts DUT), eliminating the need for separate heating systems and reducing operational conflicts
2Adaptability or versatility
If separate heating and cooling systems are used, then comprehensive thermal testing is enabled, but system complexity and cost increase
Solution Approach 1:
The patent merges heating and cooling functionalities into a single integrated refrigeration system. The heat exchanger medium serves as a thermal transfer bridge, allowing the condenser heat to be transferred to the DUT during heating mode, while the evaporator provides cooling during cooling mode. This consolidation reduces system complexity by eliminating separate heating components and interconnections
Solution Approach 2:
The refrigeration system achieves universality by using the heat exchanger medium to enable both heating and cooling operations with the same core components. The medium circulates between the condenser and DUT during heating, and the evaporator directly cools the DUT during cooling, allowing one system to replace what would traditionally require separate heating and cooling apparatus
3Temperature
If conventional cooling systems are used with thermal heads, then cooling is provided to DUT, but thermal resistance reduces heating efficiency when heating is required
Solution Approach 1:
The patent introduces a heat exchanger medium as an intermediary between the condenser and DUT for heating operations. This medium absorbs heat from the condenser and transfers it to the DUT, providing efficient heat transfer without the thermal resistance issues of conventional thermal heads. The intermediary medium enables direct thermal coupling during heating while maintaining effective cooling capability through the evaporator
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies system architecture, reduces costs, and enhances thermal control efficiency by recycling heat from cooling cycles for heating, minimizing thermal resistance and eliminating the need for separate heating media, thus improving the overall testing process.
Implementation Method 1
the thermal head functions as an evaporator where the refrigerant in a gaseous form is cold and absorbs heat transmitted from the device under test to the thermal head
Implementation Method 2
the refrigerant in a gaseous form is cold and absorbs heat transmitted from the device under test
Implementation Method 3
The gaseous refrigerant flows out of the thermal head to the compressor where it is compressed to a high pressure state that further increases the temperature of the refrigerant
Implementation Method 4
The hot refrigerant flows to the condenser where heat from the hot refrigerant is removed
Implementation Method 5
the refrigerant is converted to a liquid state
Implementation Method 6
The liquid refrigerant then flows through an expansion valve, where the pressure of the refrigerant is reduced, which also reduces the temperature of the refrigerant
Implementation Method 7
Heat is transferred from the DUT through the thermal head to the air, liquid or refrigerant flowing through the thermal head
Data Source
AI summary
A two-phase thermal system to provide cooling and heating for device testing. The two-phase thermal system utilizes a refrigeration system to cool one or more devices under test (DUTs) in a cooling mode, and heat the one or more DUTs in a heating mode. The available heat content of the hot gas from the compressor is greater than the evaporator cooling capacity of the refrigeration system, and therefore the two-phase thermal system can be utilized to both cool and heat the one or more DUTs.