Two-Phase Fluid Cooling for Semiconductor Layer Stacks
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Solution Overview
Problem
Existing cooling methods for semiconductors in electronic components, such as heat sinks, result in inefficiencies due to thermal resistance and non-negligible weight, impacting performance and bulkiness.
Innovation Solution
A two-phase fluid is used to cool semiconductors by replacing traditional heat sinks, with the fluid changing phases to absorb and dissipate heat, and a pump and condenser system managing its flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are attached to cool semiconductors, then cooling function is provided, but weight increases and thermal resistance is introduced
Solution Approach 1:
The patent removes the heat sink component entirely from the electronic assembly. Instead of attaching external heat sinks to the semiconductor, the invention integrates cooling directly into the encapsulation structure itself, which serves as both the protective enclosure and the thermal management system. This extraction of the separate heat sink component eliminates its weight while maintaining cooling functionality through the encapsulation material's inherent thermal properties.
Solution Approach 2:
The patent merges the encapsulation function with the cooling function into a single integrated component. The encapsulation material simultaneously provides mechanical protection for the semiconductor and acts as the thermal management system through its thermal conductivity properties. This consolidation eliminates the need for separate heat sinks and reduces overall component weight while maintaining effective cooling.
2Temperature
If heat sinks are attached to cool semiconductors, then cooling function is provided, but thermal resistance increases due to multiple layers
Solution Approach 1:
The patent removes the heat sink layer and associated thermal interface materials from the structure. By eliminating these intermediate components, the thermal pathway from the semiconductor to the encapsulation material is directly established, reducing the number of thermal resistance interfaces and improving overall thermal efficiency.
Solution Approach 2:
The patent employs encapsulation materials with specifically engineered thermal conductivity properties. These composite materials are designed to provide both mechanical protection and efficient heat transfer, creating an integrated solution that eliminates the need for separate heat sinks and reduces total thermal resistance through optimized material composition rather than layered construction.
3Reliability
If epoxy resin is used to protect semiconductors, then protection is provided, but cooling efficiency is reduced
Solution Approach 1:
The patent changes the material parameter of the protective encapsulation from conventional epoxy resin to materials with superior thermal conductivity properties. This parameter change allows the encapsulation material to simultaneously provide mechanical protection and efficient heat transfer, resolving the contradiction between protection and cooling efficiency by selecting materials that satisfy both requirements.
Solution Approach 2:
The patent uses composite encapsulation materials that combine protective functions with thermal management capabilities. These materials are specifically designed to have both mechanical strength for protection and high thermal conductivity for efficient heat transfer, eliminating the need to choose between protective performance and cooling efficiency that plagues conventional epoxy resin systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances cooling efficiency, reduces weight, and extends the service life of semiconductors while improving the overall performance and ease of installation.
Implementation Method 1
cooling means taking the form of a two-phase fluid filling said volume
Implementation Method 2
evacuating the heat energy from the semiconductors
Data Source
AI summary
An electronic component comprising a two-phase fluid for evacuating the heat energy from the semiconductors of said electronic component. The electronic component has a stack of layers of electrically conductive material and of layers of electrically non-conductive material, a volume being defined between two adjacent layers, and a semiconductor being arranged in said volume. The electronic component also has a cooling means taking the form of a two-phase fluid filling said volume.