Two-Phase Cooling with Vapor Displacement for Better Condensation
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Solution Overview
Problem
Existing liquid cooling systems for computer components face challenges in maximizing heat transfer efficiency due to non-equilibrium vapor distribution, leading to suboptimal coupling with condensers and reduced cooling performance.
Innovation Solution
Incorporating a vapor control device, such as a space-filling device, deformable object, inflatable bag, or expandable container, to alter the density distribution of vapor and increase its overlap with the condenser, enhancing heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If liquid cooling systems are used to improve heat transfer efficiency, then cooling performance is enhanced, but vapor distribution becomes non-equilibrium leading to suboptimal coupling with condensers
Solution Approach 1:
A vapor control device is introduced as an intermediary element between the heat source and condenser. This device actively manages vapor distribution and directs vapor flow to improve coupling with the condenser surfaces, resolving the non-equilibrium vapor distribution problem while maintaining high heat transfer efficiency
Solution Approach 2:
The system changes vapor density distribution parameters by controlling vapor generation and movement. By adjusting parameters such as vapor flow rate, density, and spatial distribution, the system achieves both efficient heat transfer and optimal vapor-condenser coupling
2Loss of energy
If vapor control devices are added to improve vapor-condenser coupling, then heat transfer efficiency increases, but device complexity increases
Solution Approach 1:
The vapor control device is designed to perform multiple functions: it controls vapor distribution, directs vapor flow, and enhances heat transfer coupling. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving improved heat transfer efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vapor control devices enhance the coupling between vapor and condenser, improving overall cooling system performance by increasing the volume of vapor in contact with the condenser, thereby increasing heat transfer efficiency.
Implementation Method 1
A vapor that partially fills the second volume is generated by a liquid coolant in the first volume
Implementation Method 2
A condenser in the second volume removes heat from the vapor to generate condensed liquid coolant
Data Source
AI summary
An embodiment two-phase cooling system includes an enclosure having a first volume and a second volume, a heat source located in the first volume, and a liquid coolant located in the first volume such that the liquid coolant is in contact with the heat source. A vapor partially filling the second volume is generated by the liquid coolant when heat generated by the heat source is absorbed by the liquid coolant. A condenser located in the second volume removes heat from the vapor, thereby condensing the vapor into condensed liquid coolant that returns to the first volume. A space-filling device, located in the second volume, partially fills the second volume, and thereby displaces the vapor from a portion of the second volume. The space-filling device increases a height of the vapor such that an overlap between the vapor and the condenser is increased, thereby increasing a condenser efficiency.