Two-Phase Cooling Structure With Capillary Wick Channels
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Solution Overview
Problem
Existing cooling systems for semiconductor devices face challenges in efficiently managing heat in confined spaces with high thermal conductivity and resistance to environmental stresses, particularly in achieving high capillary forces while minimizing viscous losses.
Innovation Solution
The development of two-phase cooling devices featuring microfabricated metal substrates with etched microstructures forming a wicking structure, an intermediate substrate with microstructures, and a vapor chamber, which utilize capillary forces to transport thermal energy across different regions of the thermal ground plane, optimizing the aspect ratio and structure for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wicking structure uses high aspect ratio microstructures to increase capillary forces, then heat transfer efficiency is improved, but viscous losses in the liquid flow increase
Solution Approach 1:
The wicking structure employs microstructures with locally optimized characteristics where high aspect ratio features are positioned in regions requiring enhanced capillary action for heat transfer, while the overall geometry is designed to minimize viscous resistance in the liquid flow paths
Solution Approach 2:
The microstructure geometry parameters (height, width, spacing) are precisely controlled within specific ranges (1-1000 micrometers) to optimize the balance between capillary force generation and viscous loss minimization, with the aspect ratio serving as a key tuning parameter
2Length of moving object
If the thermal ground plane is made thinner to conform to confined spaces, then device integration is improved, but heat transfer capability is reduced
Solution Approach 1:
The system utilizes two-phase (liquid-vapor) heat transfer mechanisms within the thin thermal ground plane structure, leveraging phase change latent heat to achieve high heat transfer rates despite the reduced thickness of the device
Solution Approach 2:
The invention compensates for reduced thickness in the vertical dimension by enhancing heat transfer through microstructured surfaces and capillary wicking networks that operate in horizontal planes, effectively distributing thermal management across multiple spatial dimensions
3Force
If the wicking structure is designed for high capillary force to support large pressure differences, then liquid transport is improved, but the structural complexity increases
Solution Approach 1:
The wicking structure is segmented into distinct functional regions (evaporator, adiabatic, condenser zones) with microstructures optimized for specific local requirements, allowing high capillary force to be concentrated where needed without uniformly increasing complexity throughout the entire device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables higher heat transfer rates, thinner thermal ground planes, and improved resistance to gravity and environmental stresses, while maintaining stability and minimizing viscous losses, thereby enhancing the performance of semiconductor cooling systems.
Implementation Method 1
a fluid may be contained within the wicking structure and vapor chamber for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure
Implementation Method 2
the working fluid adsorbs or rejects heat by changing phases between liquid and vapor
Data Source
AI summary
The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor chamber for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The intermediate substrate may form narrow channels within the wicking structure, providing high capillary forces to support large pressure differences between the liquid and vapor phases, while minimizing viscous losses of the liquid flowing in the wicking structure.