Two-Sided Millimeter Wave Antenna Using TSVs for PCB Space Limits
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Solution Overview
Problem
The existing millimeter wave antennas in mobile devices face challenges due to space constraints on printed circuit boards, limiting their size and mobility, as they require a larger area for effective millimeter wave communication.
Innovation Solution
A two-sided millimeter wave antenna system is implemented using through-silicon-vias, where one portion of the antenna is integrated within device layers on a semiconductor substrate's first side and another portion is positioned on the second side, electrically coupled via vias, allowing for sufficient area allocation for millimeter wave transmissions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If millimeter wave antennas are deposited on a printed circuit board within a mobile device, then millimeter wave communication capability is achieved, but the area occupied by the antennas decreases the density of devices attached to the PCB and results in larger, less mobile devices
Solution Approach 1:
The antenna structure is extended from a single-plane PCB configuration to a three-dimensional configuration that utilizes both sides of the semiconductor substrate. Through-silicon vias provide vertical interconnection, transforming the antenna from a two-dimensional planar structure to a three-dimensional folded structure that achieves sufficient antenna area without increasing PCB footprint.
2Area of stationary object
If the antenna is included within a device layer of an integrated circuit, then space is saved on the PCB, but the device layer may not include enough space for a complete antenna usable for millimeter wave communication
Solution Approach 1:
The complete antenna structure is divided into multiple segments: a first portion formed within device layers on the first side of the substrate, and a second portion formed on the second side of the substrate. These segments are connected through through-silicon vias, allowing the antenna to achieve sufficient total area while being distributed across both sides of the substrate.
Solution Approach 2:
The antenna structure is nested within the semiconductor substrate itself, utilizing the substrate's thickness and both surfaces. The through-silicon vias penetrate through the substrate, creating a folded antenna configuration that is contained within the device package boundaries rather than requiring external PCB space.
3Area of moving object
If a via passes through the substrate to electrically couple antenna portions, then sufficient antenna area is achieved, but additional manufacturing steps are required
Solution Approach 1:
The through-silicon vias serve multiple functions: they provide electrical interconnection between the first and second portions of the antenna, and they enable the antenna to achieve sufficient area by connecting both sides of the substrate. The same via structure that is necessary for three-dimensional interconnection also enables the folded antenna geometry.
Data Source
AI summary
A system may include a first semiconductor substrate having a first side and a second side opposite the first side. The system may further include multiple device layers positioned on the first side of the substrate. The system may also include a first portion of an antenna structure positioned within at least one of the multiple device layers. The system may include a second portion of the antenna structure positioned over the second side of the substrate. The system may further include a via passing through the substrate and electrically coupling the first portion of the antenna structure to the second portion of the antenna structure.