Groundskeeping Tool Control Assembly With Two-Sided Heat-Sink Layout
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic control and command assemblies for groundskeeping tools face limitations in heat dissipation due to the obstruction of heat sinks by connectors and taller electronic components, restricting their size and efficiency.
Innovation Solution
The assembly repositions connectors and taller components on a second major face of the support plate, allowing a larger heat sink base face, and uses a heat sink with a lowering and polymeric material for secure fixation, enhancing heat dissipation and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If connectors and terminals are positioned on the same side as power electronic components, then cable connection is facilitated, but heat sink base extension is obstructed
Solution Approach 1:
The support plate is divided into two functional sides: one side hosts power electronic components and heat sink contact points, while the other side accommodates connectors and terminals. This spatial segmentation resolves the conflict between cable accessibility and heat sink base extension by distributing different functional requirements to separate regions.
Solution Approach 2:
The solution transitions from a one-sided arrangement to a two-sided arrangement on the support plate. By utilizing the second major face for connectors and terminals, the design effectively adds a dimensional layer to the layout, allowing both heat sink requirements and cable connection requirements to be satisfied simultaneously without spatial conflict.
2Device complexity
If taller electronic components are positioned on the same side as heat sink contact points, then component integration is simplified, but heat dissipation efficiency is reduced
Solution Approach 1:
Electronic components are segmented and distributed across two sides of the support plate based on their functional requirements. Heat-generating power components are positioned on the first side for optimal heat sink contact, while taller components are relocated to the second side, eliminating interference with heat dissipation pathways.
Solution Approach 2:
Different regions of the support plate are assigned different functional qualities: the first side is optimized for thermal management with direct heat sink contact, while the second side is optimized for electrical connectivity with connector placement. This local differentiation resolves the contradiction between integration simplicity and heat dissipation efficiency.
3Temperature
If heat sink base is enlarged for better heat dissipation, then thermal management improves, but device dimensions increase
Solution Approach 1:
The design utilizes the second major face of the support plate to accommodate connectors and terminals, effectively adding a vertical/dimensional layer to the layout. This allows the heat sink base on the first face to be enlarged for improved thermal management without increasing the overall footprint of the device, as the additional components are arranged in a different spatial dimension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables larger heat sink bases for improved heat dissipation and tool ergonomics, while maintaining compact dimensions, facilitating better design and functionality in groundskeeping tools.
Implementation Method 1
a heat sink body (60, 60'), in particular an aluminium or copper body fitted with fins, configured to dissipate the heat generated by the electronic board
Implementation Method 2
an aluminium or copper body fitted with fins, configured to dissipate the heat
Data Source
AI summary
A control and command electronic assembly (20,20′) for a groundskeeping tool is described, said control and command electronic assembly comprising a heat sink body (60,60′) and a control and command electronic board (25,25′), said electronic board comprising: a support plate (30,30′) provided with a first major face (35,35′) and an opposite second major face (40,40′), a plurality of electronic components (45,50) fixed to the support plate (30,30′) and comprising at least one electronic component (45), which generates heat that must be dissipated by means of the heat sink body and which has a predetermined height from the major face, between the first and the second, on which it is fixed of the support plate, and a connection body (55) fixed to the support plate (30,30′) and adapted to allow the removable connection to the electronic board (25,25′) of a cable, and/or another electronic component (50) of the plurality of electronic components, which is fixed to the support plate (30,30′) and has a predetermined height from a portion of the plate on which it is fixed that is greater than the predetermined height of the electronic component whose heat is to be dissipated. Wherein the heat sink body comprises a base face (65,65′) facing onto the first major face (35,35′) of the support plate and the connection body (55) and/or the other electronic component (50) is fixed to the second major face (40,40′) of the support plate.