Two-Sided Power Module Layout for Electric Drive Systems
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Solution Overview
Problem
Conventional power modules for switched reluctance machines in multi-stage applications face scalability issues due to their one-sided configuration, leading to increased size and susceptibility to failures from high current rise rates and parasitic inductance, which causes voltage overshoot and premature switch failures.
Innovation Solution
A power module design utilizing a heat sink with switches on both surfaces and capacitors adjacent to the edge, coupled symmetrically by a bus bar assembly to minimize inductance paths and reduce parasitic inductance, thereby enhancing reliability and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional one-sided power module configuration is used, then the design is simple to implement, but the size and length of the power module sharply increase for each converter circuit added
Solution Approach 1:
The patent transitions from a one-sided linear arrangement to a two-sided symmetric configuration, utilizing both surfaces of the heat sink substrate. This dimensional change allows converter circuits to be distributed across both sides, effectively reducing the overall length of the power module while maintaining all necessary electrical connections and functional capabilities.
2Device complexity
If conventional one-sided power module configuration is used, then the design is simple, but the inductance path length increases causing higher parasitic inductance
Solution Approach 1:
The patent employs symmetric design principles where converter circuits are evenly distributed across both sides of the heat sink, creating balanced current paths. This symmetry ensures that inductance paths from capacitors to switches are equidistant and equal, minimizing parasitic inductance differences and reducing voltage overshoot, thereby improving switch reliability.
3Ease of manufacture
If conventional power module configuration is used, then the layout is straightforward, but voltage overshoot conditions occur due to high inductance paths
Solution Approach 1:
The patent changes the geometric parameters of the power module layout by distributing components symmetrically across both sides of the heat sink. This parameter change reduces the inductance path length and creates equidistant connections, directly reducing the magnitude of voltage overshoot caused by high di/dt switching events while maintaining manufacturing simplicity.
4Power
If more converter circuits are added to meet higher power demands, then the system power capacity increases, but the power module size increases sharply
Solution Approach 1:
The patent utilizes both sides of the heat sink substrate to accommodate additional converter circuits, effectively doubling the available mounting area. This two-sided configuration allows higher power capacity to be achieved without proportionally increasing the overall module volume, as components are distributed in three-dimensional space rather than extending linearly in one direction.
Data Source
AI summary
A multi-stage power module is provided. The multi-stage power module may include at least one heat sink having a first surface, a second surface and an edge, a first set of switches disposed on the first surface of the heat sink, a second set of switches disposed on the second surface of the heat sink, a plurality of capacitors disposed adjacent to the edge of the heat sink, and a bus bar assembly symmetrically coupling the capacitors to each of the first set of switches and the second set of switches.