Two-Sided Redistribution Layer for Thermal and Signal Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices face challenges with thermal regulation and communication efficiency due to the positioning of high-bandwidth memory cubes and host devices on the same side of an interposer, leading to suboptimal heat dissipation and increased noise and latency in data transfer.
Innovation Solution
Implementing high-bandwidth memory cubes and host devices on opposite sides of an interposer, with connective circuitry extending between them, allowing for shorter interconnects and improved thermal regulation using a thermally conductive lid that surrounds both components, while reducing noise and latency through direct connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If high-bandwidth memory cubes and host devices are positioned on the same side of an interposer, then connectivity is simplified, but thermal regulation deteriorates and noise increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement where all components are on the same side of the interposer to a three-dimensional configuration utilizing both sides of the interposer. By positioning high-bandwidth memory cubes on one side and host devices on the opposite side, the invention effectively adds a dimensional aspect to the layout, enabling shorter interconnects and improved thermal management without increasing connectivity complexity.
2Ease of manufacture
If high-bandwidth memory cubes and host devices are positioned on the same side of an interposer, then assembly is simplified, but communication efficiency deteriorates due to increased latency
Solution Approach 1:
The invention utilizes the third dimension by stacking components on opposite sides of the interposer, reducing the lateral distance signals must travel. This vertical arrangement through the interposer significantly shortens interconnect length compared to lateral routing on the same side, thereby reducing data transfer latency while maintaining assembly simplicity through standardized bonding processes.
3Ease of manufacture
If conventional packaging is used with components on the same side, then manufacturing process is conventional, but thermal dissipation is suboptimal
Solution Approach 1:
The patent segments the component layout by separating high-bandwidth memory cubes and host devices onto opposite sides of the interposer. This segmentation allows independent optimization of thermal pathways for each component type, enabling more effective heat dissipation strategies such as dedicated thermal vias and heat sinks positioned close to each heat-generating component without interfering with the other.
Solution Approach 2:
By utilizing both sides of the interposer in a three-dimensional arrangement, the invention creates additional thermal pathways through the interposer structure itself. Thermal regulation elements can be positioned in close proximity to heat-generating components on either side, and heat can be conducted through the interposer substrate, significantly improving thermal dissipation efficiency compared to conventional single-sided packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal regulation and communication efficiency by shortening interconnects and enabling closer proximity of thermal regulation elements to heat-generating components, thereby improving heat dissipation and reducing noise and latency in data transfer.
Implementation Method 1
improved thermal regulation using a thermally conductive lid that surrounds both components
Data Source
AI summary
A semiconductor device with a two-sided redistribution layer is disclosed. The semiconductor device comprises a host device and one or more memory stack cubes. A redistribution layer is disposed between and couples the host device and the memory stack cubes. This redistribution layer features an edge surface extending between the host device and the memory stack cubes. The semiconductor device includes first connective circuitry that extends through the redistribution layer, is coupled with the host device, and is exposed at the edge surface of the redistribution layer. Additionally, second connective circuitry extends through the redistribution layer, is coupled with the memory stack cubes, and is exposed at the edge surface of the redistribution layer. Connective structures couple the first and second connective circuitry exposed at the edge surface of the redistribution layer.