Two-Sided Vapor Chamber Packaging for Semiconductor Heat Dissipation
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Solution Overview
Problem
Heat generated by semiconductor components becomes trapped between the package substrate and the mounting structure, leading to prolonged exposure to high temperatures, reduced performance, and premature failure of the components.
Innovation Solution
Implementing a two-sided thermal management system with thermal lid structures on both sides of the package substrate, incorporating vapor chambers and fins to dissipate heat from semiconductor dies and integrated circuit devices, enhancing thermal transfer and reducing vertical size for improved reliability and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor components are mounted on both sides of the package substrate, then component density and functionality are improved, but heat dissipation becomes insufficient and thermal stress increases
Solution Approach 1:
The thermal management system is segmented into two independent vapor chamber lid structures, one for each side of the substrate. Each lid structure independently manages heat from semiconductor components on its respective side, allowing high component density on both sides without thermal interference between them.
Solution Approach 2:
The patent transitions from conventional single-sided or bottom-only thermal management to two-sided thermal management by adding vapor chamber lid structures on both the top and bottom sides of the substrate. This dimensional expansion enables heat dissipation from all heat-generating components regardless of their location.
2Device complexity
If conventional single-sided thermal management is used, then device complexity is low, but heat generated from components on both sides cannot be effectively dissipated
Solution Approach 1:
Each vapor chamber lid structure serves multiple functions: it provides thermal management for components on its side, acts as a mechanical support structure, and creates a controlled environment for the semiconductor components. This multi-functionality justifies the increased structural complexity by delivering comprehensive protection and management.
3Device complexity
If heat is allowed to accumulate between substrate and mounting structure, then device structure remains simple, but component performance degrades and failure occurs
Solution Approach 1:
The vapor chamber lid structures act as intermediary thermal management components between the semiconductor components and the external environment. They efficiently capture heat from components on both sides of the substrate and transfer it to heat sinks, preventing heat accumulation that would otherwise lead to component failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The two-sided thermal management system effectively dissipates heat from both sides of the package substrate, maintaining lower operating temperatures, increasing component performance and longevity, and enhancing reliability.
Implementation Method 1
a first vapor chamber lid structure over the plurality of semiconductor dies and thermally coupled with the plurality of semiconductor dies. The semiconductor device package includes a second vapor chamber lid structure over the plurality of integrated circuit devices and thermally coupled with the plurality of integrated circuit devices
Implementation Method 2
thermally coupled with the plurality of semiconductor dies. The semiconductor device package includes a second vapor chamber lid structure over the plurality of integrated circuit devices and thermally coupled with the plurality of integrated circuit devices
Implementation Method 3
incorporating vapor chambers and fins to dissipate heat from semiconductor dies and integrated circuit devices, enhancing thermal transfer
Data Source
AI summary
Thermal management components are included over semiconductor components on both sides of a package substrate of a semiconductor device package to provide two-sided thermal management system for the semiconductor device package. The two-sided thermal management system of the semiconductor device package enables heat to be dissipated from the semiconductor components on both sides of the package substrate of the semiconductor device package. This enables the semiconductor components on both sides of the package substrate of the semiconductor device package to operate at lower temperatures, which may increase the performance of the semiconductor components, may enable the performance of the semiconductor components to be sustained for longer time durations, and/or may increase the reliability and longevity of the semiconductor components, among other examples.