Two-Stage Heat Dissipating Unit for Compact Cooling
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Solution Overview
Problem
Conventional cooling devices for compact and lightweight electronic apparatuses face challenges in enhancing cooling efficiency without increasing size and weight, as they require larger heat dissipation plates and more powerful fans to achieve better cooling, making it difficult to store them in a compact form.
Innovation Solution
A cooling device with a heat dissipating unit having a two-stage configuration and an air blowing unit with dual inlet ports, where the first inlet port faces the first stage portion and the outlet port faces the second stage portion, allowing for efficient heat dissipation using a single sirocco fan by utilizing both the inlet and outlet air flows.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the surface area of the heat dissipation plate is increased to enhance cooling efficiency, then cooling efficiency is improved, but the size and weight of the device increase
Solution Approach 1:
The heat dissipation plate is designed with a two-stage structure having different levels, transitioning from a flat two-dimensional surface to a three-dimensional multi-level configuration. This dimensional change allows the air flow path to be extended and the contact area between cooling air and heat dissipation plate to be increased without proportionally increasing the overall device footprint or weight.
2Reliability
If a more powerful fan is used to increase wind speed and cooling capacity, then cooling efficiency is improved, but the size and weight of the device increase
Solution Approach 1:
The cooling device is segmented into two functional stages: a first stage for air intake and initial cooling, and a second stage for enhanced air flow and heat dissipation. This segmentation allows the system to achieve high cooling capacity through optimized air flow paths and thermal contact areas rather than relying solely on a single powerful fan, thereby reducing the fan's required power and weight.
3Reliability
If the contact area between cooling air and heat dissipation plate is enlarged to enhance cooling efficiency, then cooling efficiency is improved, but the device complexity increases
Solution Approach 1:
The heat dissipation plate incorporates a two-stage structure with different levels, creating a three-dimensional configuration that increases the contact area between cooling air and the plate. This dimensional approach allows for enhanced thermal contact without requiring complex multi-component assemblies, as the increased surface area is achieved through the plate's own geometric design rather than additional attached structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency by increasing the contact area between cooling air and the heat dissipating unit while maintaining a compact size, allowing for effective cooling of electronic apparatuses without the need for larger fans or increased weight.
Implementation Method 1
a heat dissipating unit that is in contact with an object to be cooled and dissipates heat
Implementation Method 2
an air blowing unit that takes therein air and blows the air to the heat dissipating unit
Data Source
AI summary
A cooling device includes a heat dissipating unit that is in contact with an object to be cooled and dissipates heat, and an air blowing unit that takes therein air and blows the air to the heat dissipating unit. The heat dissipating unit includes a first stage portion and a second stage portion that have a difference in level therebetween. The air blowing unit includes a first inlet port that takes therein air from outside, and an outlet port that exhausts the taken-in air. The first inlet port faces the first stage portion, and the outlet port faces the second stage portion.