Two-Stage Liquid Cooling Assembly for High-Power Electronics
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Solution Overview
Problem
Conventional heat dissipation systems in electronic equipment, particularly those combining air and water cooling, fail to sufficiently cool the working fluid, leading to inefficient heat dissipation and potential overheating of power heat sources, which can result in equipment failure.
Innovation Solution
A composite heat dissipation system with an internal circulation assembly featuring water blocks and radiators, connected via pipes, and an external forced cooling assembly, along with enhanced pushing fans, to achieve two-stage heat dissipation and increased convection, ensuring the working fluid is cooled effectively before recirculating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional air cooling or simple water cooling systems are used, then the system structure is simple, but the heat dissipation efficiency is insufficient and cannot meet high power heat source requirements
Solution Approach 1:
The heat dissipation system is divided into multiple independent modules: water blocks for direct heat absorption from power heat sources, radiators for passive heat dissipation, and forced cooling assemblies for active heat removal. Each module operates semi-independently, allowing the system to achieve high heat dissipation efficiency through modular composition while maintaining relatively simple individual component structures.
Solution Approach 2:
The patent combines multiple heat dissipation mechanisms (water cooling, radiation, and forced convection) into a composite system. The water blocks absorb heat directly from power heat sources, radiators dissipate heat passively through large surface areas, and forced cooling assemblies provide active heat removal when needed. This merging of different cooling approaches enables the system to meet high power heat source requirements while maintaining structural simplicity through standardized component design.
2Reliability
If more fans are added to enhance convection, then the heat dissipation performance improves, but the device complexity increases
Solution Approach 1:
The forced cooling assemblies are designed to be selectively activated based on thermal conditions. The system dynamically adjusts cooling intensity by engaging forced convection only when heat dissipation demands exceed passive cooling capacity, rather than operating all cooling components continuously. This dynamic operation maintains high heat dissipation performance while avoiding unnecessary complexity in normal operating conditions.
Solution Approach 2:
Radiators serve as intermediary heat dissipation devices that passively transfer heat from the working fluid to the surrounding air through large surface areas. This intermediary approach reduces the need for forced cooling by providing an intermediate heat rejection path, thereby improving heat dissipation performance without proportionally increasing the number of active cooling components.
3Volume of moving object
If the internal space of the chassis is limited, then the system unit integration is efficient, but the heat dissipation capacity is restricted
Solution Approach 1:
Radiators are designed with extended surface areas that project into the available internal space of the chassis, utilizing three-dimensional space efficiently. By adding surface area in the vertical and lateral dimensions rather than requiring additional horizontal space, the system achieves high heat dissipation capacity within limited internal volume, maintaining both compact integration and effective cooling.
Solution Approach 2:
The water blocks and radiators form a hydraulic cooling circuit that efficiently transports heat away from power heat sources through forced circulation of working fluid. This hydraulic approach provides high heat dissipation capacity in a compact form factor, as liquid cooling can remove heat more densely than air cooling, thereby maintaining reliable heat dissipation within limited internal space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances heat dissipation efficiency by maintaining a significant temperature difference between the working fluid and power heat sources, preventing heat deposition and equipment failure, while reducing the need for additional external cooling equipment.
Implementation Method 1
at least one water block mounted on a power heat source... the working fluid in the water block quickly absorbs working heat produced by the power heat source
Implementation Method 2
at least one water cooling radiator connected to the water block via pipes... the working fluid is subjected to a front stage heat dissipation
Implementation Method 3
one or more fans are used to produce airflows to push the hot air out of the chassis while pulling external cold air into the chassis to form an air cooling circulation system
Implementation Method 4
an external forced cooling assembly... the working fluid further circulates through the external forced cooling assembly and undergoes a rear stage forced heat dissipation
Data Source
AI summary
A heat dissipation assembly for electronic equipment includes an internal circulation heat dissipation assembly consisting of at least one water block mounted on a power heat source on a motherboard of the electronic equipment and at least one water cooling radiator connected to the water block via pipes; and an external forced cooling assembly connected to the internal circulation heat dissipation assembly via pipes. A working fluid in the water block quickly absorbs heat produced by the power heat source, and the working fluid with absorbed heat undergoes a front stage of heat dissipation in the water cooling radiator and a rear stage of forced heat dissipation in the external forced cooling assembly. By cooling the working fluid in multiple stages, the working fluid can have upgraded cooling efficiency to prevent heat from depositing in the power heat source and the system unit of the electronic equipment.