Two-Stage Molding for Implantable Medical Device Connectors
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Solution Overview
Problem
Existing connector module assemblies for implantable medical devices face challenges in construction and assembly, particularly in ensuring secure electrical coupling and efficient molding processes, which can lead to vulnerabilities in the hermetic seal and increased complexity.
Innovation Solution
A two-stage molding process is employed to form an insulative body for the connector module assembly, where a core portion is formed with a first shot of insulative material capturing electrical components, and an overlay portion is formed with a second shot, allowing for secure integration of contact components and antenna, while also incorporating a color indicator for type differentiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a two-stage molding process is used to form the insulative body with core portion and overlay portion, then the structural integrity and capture reliability of electrical components are improved, but the manufacturing complexity and process time increase
Solution Approach 1:
The insulative body is divided into two distinct portions: a core portion formed by a first shot of insulative material that captures the electrical components, and an overlay portion formed by a second shot that provides external protection and structural completion. This segmentation allows each portion to be optimized for its specific function while maintaining overall reliability.
Solution Approach 2:
The core portion is formed first with the electrical components already positioned and captured within the insulative material. This preliminary formation ensures that the components are securely held before the overlay portion is added, allowing for controlled assembly and reduced complexity in the final integration.
2Productivity
If electrical components are captured within the insulative body during molding, then the assembly efficiency and structural integrity are improved, but the precision of component positioning and electrical coupling may be compromised
Solution Approach 1:
Mold pins serve as intermediary elements that extend into the mold cavity to precisely position and support the electrical components during the molding process. These pins ensure accurate component placement and maintain electrical coupling precision while still allowing the components to be captured within the insulative body, thus reconciling assembly efficiency with manufacturing precision.
3Adaptability or versatility
If contact components are coupled to contact interfaces before or after forming the core portion, then the flexibility of assembly timing is improved, but the complexity of coordinating multiple assembly steps increases
Solution Approach 1:
The mold structure and insulative body design are configured to accommodate contact components that can be coupled to contact interfaces at different stages of the molding process. The same core mold structure supports both pre-assembly and post-assembly configurations, providing universal adaptability while simplifying the coordination of assembly steps through a consistent manufacturing framework.
Data Source
AI summary
Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.