Two-Stage Plasma Treatment for Fluoride Removal in OLED Electrodes
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Solution Overview
Problem
Existing methods of manufacturing organic light-emitting display devices do not effectively remove fluoride ions, which can cause deterioration, leading to a shorter lifespan of the devices.
Innovation Solution
A two-stage plasma treatment process is employed, using a first plasma gas (N2 and O2) to remove residual materials and a second plasma gas (N2 and H2) to specifically remove fluoride ions, forming a hydrogen bond and thereby preventing device deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single plasma treatment operation is performed to remove residual materials, then the manufacturing process is simple and fast, but fluoride ions remain on the electrode surface causing device deterioration
Solution Approach 1:
The single plasma treatment operation is divided into two sequential stages: first plasma treatment to remove residual materials, and second plasma treatment to remove fluoride ions. This segmentation allows each treatment to target specific contaminants, thereby improving device reliability without significantly complicating the overall process
Solution Approach 2:
The patent introduces a second plasma treatment operation as an intermediary step between the first plasma treatment and the organic layer formation. This intermediary step specifically targets fluoride ion removal, preventing device deterioration while maintaining process efficiency
2Manufacturing precision
If a first plasma gas (N2 and O2) is used to remove residual materials, then residual materials are effectively removed, but fluoride ions are activated and remain on the surface
Solution Approach 1:
The patent converts the harmful effect of fluoride ion activation into a beneficial process by introducing a second plasma treatment with hydrogen-containing gas. The activated fluoride ions react with hydrogen to form volatile HF compounds that are easily removed, transforming the harmful activated fluoride into a removable substance
Solution Approach 2:
The patent changes the chemical composition parameter of the plasma gas from an oxygen-containing mixture (N2 and O2) in the first treatment to a hydrogen-containing mixture (N2 and H2) in the second treatment. This parameter change enables the removal of activated fluoride ions through hydrogenation reactions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the lifespan of the display devices by effectively removing fluoride ions, improving interface characteristics and preventing device degradation.
Implementation Method 1
performing a first treatment operation of treating an exposed surface of the first electrode using a first plasma gas
Implementation Method 2
performing a second treatment operation after performing the first treatment operation, the second treatment operation including treating the exposed surface of the first electrode using a second plasma gas, wherein the second plasma gas is different from the first plasma gas and includes hydrogen
Implementation Method 3
Performing the second treatment operation may include forming a hydrogen bond between the fluoride ion and the second plasma gas
Data Source
AI summary
A method of manufacturing a display device, the method including providing a first electrode on a base substrate; providing a fluorine-containing pixel defining layer on the base substrate and the first electrode such that the pixel defining layer exposes at least a portion of the first electrode; pretreating the first electrode; and providing an organic layer on the first electrode after pretreating the first electrode, wherein pretreating the first electrode includes performing a first treatment operation of treating an exposed surface of the first electrode using a first plasma gas; and performing a second treatment operation after performing the first treatment operation, the second treatment operation including treating the exposed surface of the first electrode using a second plasma gas, wherein the second plasma gas is different from the first plasma gas and includes hydrogen.