Two-Stage Power Supply Module for Vertical IC Power Delivery
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Solution Overview
Problem
Traditional power supply modules in electronic devices face challenges in efficiently transmitting power to smart ICs while minimizing interference to signal traces and reducing board space occupation, especially in vertical power schemes where current transmission paths are long and interfere with signal traces.
Innovation Solution
A two-stage power supply module is implemented, with a first-stage power supply unit connected to a second-stage power supply unit via a second carrier board, allowing vertical power transmission directly to the integrated circuit chip, reducing trace and surface space occupation and minimizing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a traditional horizontal power supply scheme is used, then the power supply module can be easily implemented, but the current transmission path becomes long, reducing efficiency and occupying more mainboard space
Solution Approach 1:
The patent transitions from a traditional horizontal power supply layout to a vertical power supply scheme. The power supply module is positioned beneath the smart IC chip, and power is transmitted vertically through the mainboard via dedicated power vias. This dimensional change shortens the current transmission path, reduces parasitic inductance, and improves power transmission efficiency while occupying less mainboard surface area.
2Ease of manufacture
If a traditional horizontal power supply scheme is used, then the power supply module can be easily implemented, but it occupies more mainboard resource and interferes with signal traces
Solution Approach 1:
The patent adopts a vertical power supply architecture where the power supply module is located beneath the smart IC chip. Power is delivered vertically through the mainboard using dedicated power vias that bypass signal trace regions. This reduces the occupation of mainboard surface area and eliminates interference with signal traces, as power and signal paths are spatially separated.
3Productivity
If a vertical power supply scheme is used, then power transmission efficiency is improved, but the current transmission path still needs to be horizontally transmitted through the mainboard, causing interference to signal traces
Solution Approach 1:
The patent segments the power transmission path into distinct vertical and horizontal sections. The critical vertical section directly beneath the smart IC chip uses dedicated power vias that are electrically isolated from signal traces. The horizontal section on the mainboard surface is routed through regions specifically designated for power transmission, separate from signal trace areas. This segmentation eliminates interference between power and signal paths while maintaining efficient power delivery.
4Volume of moving object
If the power supply module height is reduced to match space constraints, then it better fits under the smart IC, but the transmission path length may increase
Solution Approach 1:
The patent compensates for increased horizontal transmission path length by optimizing the vertical dimension. The power supply module is positioned as close as possible to the smart IC chip in the vertical direction, and dedicated power vias provide direct vertical connections through the mainboard. This vertical optimization minimizes the overall current transmission path length despite reduced module height, maintaining efficient power delivery while fitting space constraints.
Data Source
AI summary
A power supply module is provided for powering an integrated circuit chip located at a first side of a first carrier board, including: a first-stage power supply unit; and a second-stage power supply unit, where one or more power input terminals of the second-stage power supply unit is electrically connected with one or more corresponding power output terminals of the first-stage power supply unit through a second carrier board; the second carrier board is configured to transmit power from the first-stage power supply unit to the second-stage power supply unit, and the second-stage power supply unit further supplies the power to the integrated circuit chip; one or more power output terminals of the second-stage power supply unit is electrically connected with one or more corresponding power terminals of the integrated circuit chip.