Two-Story Module Assembly for Layer Insulation and Shielding
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Solution Overview
Problem
Existing module structures face challenges in ensuring electrical insulation and shielding between multiple layers, particularly when a two-story structure is employed without additional substrates, leading to increased height and unstable interconnections.
Innovation Solution
A module design with a first and second floor portion, each containing component groups sealed by respective resins, uses a conductor pillar for electrical connection and a ground conductor pattern to ensure insulation and shielding, with the resins directly contacting each other and the pattern isolated from interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a two-story structure is employed without additional substrates, then component mounting density is improved, but electrical insulation and shielding between layers deteriorate
Solution Approach 1:
The patent introduces a ground conductor pattern as an intermediary layer between the first and second floor portions. This ground pattern serves as a mediator that provides both electrical insulation through the resin layer and electromagnetic shielding through the conductive pattern, resolving the contradiction between high-density mounting and reliable insulation/shielding.
Solution Approach 2:
The patent employs a composite structure combining resin materials (for insulation) and conductor materials (for shielding and electrical connection). The ground conductor pattern embedded in the resin layer creates a composite system that simultaneously achieves electrical insulation between floors and electromagnetic shielding, while maintaining mechanical integrity.
2Manufacturing precision
If sputtering is used to form interconnection, then manufacturing precision is improved, but interconnection stability deteriorates due to small thickness
Solution Approach 1:
The patent merges the interconnection function with the ground conductor pattern. Instead of relying solely on thin sputtered interconnections, the ground pattern is designed to extend and merge with interconnection paths, providing additional structural support and stability while maintaining the precision benefits of sputtering for critical signal paths.
3Adaptability or versatility
If interconnection extends on side surface of module, then connectivity is improved, but length increases which is disadvantageous
Solution Approach 1:
The patent transitions interconnection from a purely lateral (2D) path on the side surface to a three-dimensional path that utilizes the vertical dimension. By routing connections through the thickness direction via conductor pillars and utilizing the ground pattern on different planes, the design reduces the effective path length while maintaining connectivity to components on opposite sides of the module.
Data Source
AI summary
A module includes a first floor portion and a second floor portion in contact with an upper side of the first floor portion. Each of the first and second floor portions include a component group and a sealing resin sealing the component group. An interconnection is electrically connected to each component of the second component group on a lower surface of the second floor portion. A conductor pillar is in the first floor portion and extends through the first sealing resin in a thickness direction to electrically connect a lower surface of the first floor portion and the lower surface of the second floor portion. A ground conductor pattern covers at least a part of a 10 reference region. The ground conductor pattern is electrically isolated from the interconnection. The first sealing resin and the second sealing resin are in direct contact with each other in at least any part.