Two-Substrate Semiconductor Package With Embedded Stiffener
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Solution Overview
Problem
Semiconductor packages face issues with flexing or bowing due to temperature changes, leading to stress on solder connections and potential damage, which impairs functionality, and the use of stiffeners on the top surface is not practical for high-speed applications as it reduces available space and creates more stress on solder connections.
Innovation Solution
A semiconductor package design featuring two substrates with electrically conductive components and slots plated with conductive material, aligned for electrical connection, and a stiffener integrated within the second substrate to reduce flexing without occupying top surface space, allowing for efficient power transmission and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a stiffener is placed on the top surface of the semiconductor package, then the resistance to flexing or bowing is improved, but the available space for components is reduced and stress on solder connections increases
Solution Approach 1:
The stiffener is moved from the top surface (2D plane) to the interior volume of the second substrate, transitioning the support function to a different spatial dimension. This allows the top surface to remain fully available for components while the interior stiffener provides structural support against flexing and bowing.
Solution Approach 2:
The stiffener is nested within the second substrate, embedding the support structure inside the substrate itself rather than placing it on the exterior. This nested configuration provides internal reinforcement while maintaining external surface area for component placement.
2Reliability
If traditional solder connections are used to connect substrates, then electrical connection is achieved, but damage to solder connections occurs due to stress from temperature changes
Solution Approach 1:
The solder connections are extracted and replaced with plated slots that extend through the second substrate. This removal of solder joints eliminates the weak point that was susceptible to thermal stress damage, while the plated slot provides a more robust electrical connection path.
Solution Approach 2:
The mechanical solder joint system is replaced with an electroplated conductive slot system. The plated slot provides both mechanical strength and electrical conductivity, substituting the fragile mechanical solder connection with a more durable electrochemical bonding structure.
3Loss of energy
If plated slots extending through the second substrate are used, then electrical path efficiency is improved and solder joints are reduced, but manufacturing complexity increases
Solution Approach 1:
The plated slots serve multiple functions simultaneously: they provide electrical conductivity for power transmission, mechanical support for the substrate structure, and thermal management pathways. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process despite the plated slot requirement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design provides a low-loss, efficient electrical path, reduces the need for solder joints, enhances thermal performance, and allows for more components on the top surface, improving the semiconductor package's functionality and operable life.
Implementation Method 1
the bottom surface of the first substrate is connected to the top surface of the second substrate via at least one bonding layer
Implementation Method 2
the one or more slots are each plated with an electrically conductive material
Data Source
AI summary
A semiconductor package includes a first substrate having a top surface and a bottom surface, and a second substrate having a top surface and a bottom surface. The bottom surface of the first substrate is connected to the top surface of the second substrate via at least one bonding layer. The first substrate includes one or more electrically conductive components arranged on the bottom surface of the first substrate in a first pattern. The second substrate includes one or more slots arranged on the bottom surface of the second substrate in a second pattern. The one or more slots are each plated with an electrically conductive material. The arrangement of the one or more electrically conductive components in the first pattern is aligned with the arrangement of the one or more slots in the second pattern. The second substrate includes a stiffener disposed within the second substrate.