Two-Substrate Vibration Element Packaging for Thinner Oscillators
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Solution Overview
Problem
Existing vibration devices are difficult to miniaturize due to the need for three substrates to form the space that accommodates the vibration element, leading to increased thickness and complexity.
Innovation Solution
A vibration device configuration using two substrates, a base and a lid, where the vibration element is accommodated in a space formed between them, with the first integrated circuit on one substrate and the second integrated circuit on the other, allowing for miniaturization and improved circuit design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If three substrates (first semiconductor substrate, second semiconductor substrate, and frame portion) are used to form the space accommodating the vibration element, then the vibration device can be assembled with separate components, but the thickness of the vibration device increases and miniaturization becomes difficult
Solution Approach 1:
The patent merges the frame portion with either the first or second semiconductor substrate to form an integrated two-substrate structure. This combining eliminates the need for a separate third substrate, thereby reducing the overall thickness of the vibration device while maintaining the enclosed space for the vibration element. The merging principle directly resolves the contradiction by consolidating structural functions into fewer components.
2Strength
If three substrates are used to form the enclosing space, then structural support is provided, but the device complexity increases
Solution Approach 1:
By integrating the frame portion with one of the semiconductor substrates, the patent reduces the total number of discrete components from three to two. This merging maintains the necessary structural support functions while simplifying the overall device architecture, thereby reducing complexity without compromising structural integrity.
Solution Approach 2:
The semiconductor substrate that incorporates the frame portion serves multiple functions: it provides structural support, houses integrated circuits, and forms part of the enclosing space. This multi-functionality reduces the need for separate dedicated structural components, thereby reducing device complexity while maintaining strength.
3Reliability
If the vibration element is accommodated in a space formed by three substrates, then the space can be sealed, but the distance between integrated circuits and vibration element increases leading to noise
Solution Approach 1:
By reducing the number of substrates from three to two, the patent minimizes the distance between the integrated circuits and the vibration element. This reduction in spacing decreases the path length for noise transmission and interference, thereby reducing harmful electromagnetic noise while maintaining effective sealing of the accommodation space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The two-substrate configuration enables the vibration device to be thinned and miniaturized, while maintaining airtightness and improving resonation characteristics, with enhanced temperature compensation and reduced noise in the oscillation signal.
Implementation Method 1
a piezoelectric element which has a piezoelectric substrate and electrodes
Implementation Method 2
a piezoelectric element which has a piezoelectric substrate and electrodes
Data Source
AI summary
A vibration device includes: a first substrate including a first surface and a second surface located at an opposite side of the first surface, and a first integrated circuit disposed on at least one of the first surface and the second surface; a second substrate including a third surface bonded to the second surface, a fourth surface located at an opposite side of the third surface, a recess that opens to the third surface, and a second integrated circuit disposed on the fourth surface; and a vibration element accommodated in a space defined by an opening of the recess being closed by the first substrate.