Two Terminal Packaging via Patterned Metal Sheet Electrodes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current packaging methods for two-terminal devices like LEDs are inefficient in forming electrodes and managing contact distances, leading to suboptimal electrical connections and light extraction efficiency.
Innovation Solution
A method involving patterning a metal sheet with openings to match contact distances of two-terminal devices, bonding the sheet to the devices, and cutting it to form electrodes, allowing for precise electrical connections and improved light extraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate cavity with electrode layers and openings is used to separate anode and cathode, then electrical connections are formed, but the packaging process becomes complex and time-consuming
Solution Approach 1:
The metal sheet is segmented into multiple openings, with each opening corresponding to a specific LED chip position. This segmentation allows individual electrode formation for each chip while maintaining a unified packaging structure, reducing overall process complexity
Solution Approach 2:
The metal sheet is pre-patterned with openings before bonding to the LED chips. This preliminary action eliminates the need for subsequent electrode formation steps, simplifying the packaging process while ensuring reliable electrical connections
2Productivity
If metal wires are directly distributed on ceramic material to finish LED package units, then high density packaging is achieved, but the distance management between contacts becomes suboptimal
Solution Approach 1:
The metal sheet provides locally optimized electrode configurations for each LED chip position. Each opening is precisely positioned to match the contact distance requirements of individual chips, enabling high-density packaging while maintaining precise contact distance control
Solution Approach 2:
The patterned metal sheet acts as an intermediary between the LED chips and the packaging substrate. It mediates the electrical connections by providing pre-formed electrode structures that match the contact distances, eliminating the need for complex wire distribution
3Ease of manufacture
If conventional packaging methods are used with substrate cavities, then LEDs can be packaged, but light extraction efficiency is suboptimal
Solution Approach 1:
The invention extracts the electrode formation step from the traditional cavity-based packaging process. By using a pre-patterned metal sheet with openings, the electrodes are formed separately and then bonded to the chips, allowing optimization of light extraction paths without compromising manufacturing ease
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the packaging of two-terminal devices by forming efficient electrodes and improving light extraction, making it suitable for large-scale epitaxial growth and high-density packaging arrays.
Implementation Method 1
bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device
Data Source
AI summary
A solution for packaging a two terminal device, such as a light emitting diode, is provided. In one embodiment, a method of packaging a two terminal device includes: patterning a metal sheet to include a plurality of openings; bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device; and cutting the metal sheet around each of the least one two terminal device, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact.


