Two-Way Fluid Sensor with Through-Hole Membrane for Higher Sensitivity

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Solution Overview

Problem

Conductometric fluid sensors based on organic semiconductive materials face limitations such as limited surface area for interaction, inability for vertical integration with other devices, high operating voltage, and high fabrication complexity.

Innovation Solution

A two-way fluid sensing device utilizing a through-hole membrane as a substrate with interdigitated electrodes and a fluid sensing layer, allowing fluid molecules to interact from both sides through nanochannels, enhancing sensitivity and enabling vertical integration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If a conventional substrate is used for conductometric fluid sensors, then the sensor can be fabricated with simple structure, but the surface area for fluid interaction is limited

Engineering Contradiction:
Improvesurface area for fluid interactionVSAvoidsensor structure
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent employs a porous substrate with through-holes that allow fluid molecules to penetrate and interact with the fluid sensing layer from both top and bottom surfaces. This porous structure dramatically increases the effective surface area for fluid interaction compared to conventional solid substrates, while the through-hole design maintains structural simplicity and enables straightforward fabrication processes.

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The invention transitions from a conventional single-sided sensing architecture to a dual-sided sensing configuration by introducing through-holes that extend vertically through the substrate. This dimensional change allows fluid molecules to access the sensing layer from multiple directions (top and bottom), effectively doubling the interaction surface area without significantly increasing the planar footprint of the device.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If conventional sensor architecture is used, then fabrication can be simplified, but vertical integration with other devices is prevented

Engineering Contradiction:
Improvevertical integration capabilityVSAvoidsensor architecture
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The substrate is segmented into multiple regions including through-holes that create distinct top and bottom surfaces. This segmentation allows independent access to the fluid sensing layer from both surfaces, enabling the sensor to be integrated vertically with other devices while maintaining simple planar fabrication processes for each layer.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

By introducing vertical through-holes, the invention creates a three-dimensional sensing architecture that allows vertical integration pathways. Other electronic devices can be positioned above or below the sensor plane and connect through the through-hole structure, enabling vertical stacking and integration without requiring complex lateral routing.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Measurement precision

If organic semiconductive materials are used, then fabrication cost is reduced and process is simplified, but sensitivity and limit of detection are lower

Engineering Contradiction:
Improvesensitivity and limit of detectionVSAvoidfabrication process
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The porous substrate with through-holes provides a large surface area for the organic semiconductive sensing layer, enabling enhanced sensitivity despite using lower-cost organic materials instead of inorganic semiconductors. The increased interaction area compensates for the inherently lower sensitivity of organic materials, while the simple porous structure maintains ease of fabrication.

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The through-hole substrate serves multiple functions simultaneously: it provides mechanical support, creates large surface area for sensing, enables dual-sided fluid access, and facilitates vertical integration. This multi-functionality allows the use of simple, low-cost organic semiconductive materials while achieving high sensitivity through architectural design rather than material complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device achieves higher sensitivity with lower detection limits and supports vertical integration with other electronic devices while maintaining efficient fluid sensing functionality.

Implementation Method 1

a through-hole membrane having a plurality of channels penetrating from a top surface of the substrate to a bottom surface of the substrate

Methodology Applied
Scientific EffectDiffusion: Diffusion

Data Source

PatentUS12510507B2Two-way fluid sensing device, two-way fluid sensing method, and the manufacturing method of the fluid sensing device
Publication Date: 2025.12.30 MING CHI UNIVERSITY OF TECHNOLOGY
  • US12510507B2 patent drawing
  • US12510507B2 patent drawing
  • US12510507B2 patent drawing

AI summary

Provided are a two-way fluid sensing device, a two-way fluid sensing method, and the manufacturing method of the fluid sensing device. The fluid sensing device includes: a substrate, which is a through-hole membrane with channels penetrating from the top surface to the bottom surface of the substrate; an interdigitated electrode having a plurality of interdigitated structures and disposed on the substrate; and a fluid sensing layer containing fluid sensing material and disposed on the interdigitated electrode. Therefore, fluid molecules can interact with the fluid sensing layer from both the top and bottom sides of the fluid sensing device, such that the fluid sensing device of the present invention can exhibit higher sensitivity, and can be vertically integrated with other electronic devices or 3D circuits.