TWS Earphone Crossover Circuit for Multi-Speaker Sound Quality
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Solution Overview
Problem
Conventional TWS earphones lack a frequency division function, resulting in poor sound quality and user experience due to the use of a single speaker on each side.
Innovation Solution
A TWS earphone with multiple speakers and a crossover circuit that divides audio signals received wirelessly by a Bluetooth module into medium-low frequency and high frequency signals, which are then transmitted to dynamic speakers and balanced armatures with different response features, respectively, to improve sound quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single speaker is used in conventional TWS earphones, then the device complexity is low, but the sound quality is poor
Solution Approach 1:
The audio frequency range is segmented into different bands (low-frequency, mid-frequency, high-frequency), and each band is assigned to a dedicated speaker unit with appropriate acoustic characteristics. This segmentation allows each speaker to optimize its performance for specific frequency ranges, thereby improving overall sound quality while maintaining manageable system complexity through functional division.
Solution Approach 2:
Different speaker units are designed with locally optimized acoustic properties suited to their specific frequency responsibilities. The low-frequency speaker is designed for bass reproduction, mid-frequency speakers for vocal and instrument ranges, and high-frequency speakers for cymbals and harmonics. This local quality optimization ensures each component contributes maximally to its designated frequency band.
2Reliability
If multiple speakers with different response features are used, then full frequency sound reproduction is achieved, but the device structure becomes more complex
Solution Approach 1:
The earphone structure is segmented into multiple independent speaker modules, each handling specific frequency ranges. This modular segmentation enables full frequency coverage while keeping individual component complexity low and facilitating streamlined assembly processes.
Solution Approach 2:
The crossover circuit serves multiple functions simultaneously: it divides frequency bands, routes signals to appropriate speakers, and provides impedance matching. This multi-functionality reduces the need for separate dedicated components, thereby managing overall structural complexity despite the presence of multiple speakers.
3Reliability
If a crossover circuit is added to divide audio signals, then frequency division function is achieved, but the device complexity increases
Solution Approach 1:
The crossover circuit is merged with the amplifier and signal processing functions into a single integrated circuit module. This consolidation provides the necessary frequency division capability while avoiding the complexity of separate discrete components for each function, thereby achieving frequency division with minimized circuit complexity.
Solution Approach 2:
The integrated circuit performs multiple tasks including audio signal amplification, frequency band division, and speaker impedance matching simultaneously. This multi-functionality eliminates the need for separate dedicated circuits for each task, reducing overall circuit complexity while maintaining full frequency division capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances sound quality and user experience by allowing full frequency sound reproduction, making the earphones more portable and effective.
Implementation Method 1
at least two dynamic speakers with different response features electrically connected to the crossover circuit
Implementation Method 2
at least one balanced armature with a different frequency from that of the at least one dynamic speaker
Data Source
AI summary
A TWS earphone with multiple speakers and a crossover circuit embedded therein includes a body and a circuit unit set in the body. The circuit unit includes a Bluetooth module, a crossover circuit electrically connected to the Bluetooth module, at least two dynamic speakers or an assembly of at least one dynamic speaker and at least one balanced armature, with different response features, electrically connected to the crossover circuit, and a battery module supplying power for the circuit unit. The Bluetooth module is configured to wirelessly receive audio signals and then output the audio signals to the crossover circuit for frequency division. The crossover circuit is configured to transmit medium-low frequency audio signals after frequency division to one dynamic speaker and high frequency audio signals to the other dynamic speaker or the balanced armature.