TxPIC Chip Integrating Modulated Sources and Wavelength Selective Combiner

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Solution Overview

Problem

Conventional DWDM optical networks require numerous discrete optical components and precise alignment, leading to increased complexity and cost due to the need for dispersion compensation and amplification across different fiber types, which limits the data rate and channel density.

Innovation Solution

A photonic integrated circuit (PIC) chip with integrated modulated sources and a wavelength selective combiner eliminates the need for discrete optical components by integrating multiple modulated sources and a combiner on a single chip, enabling standardized wavelength grid operation and reduced optical alignment requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If discrete optical components are used for DWDM optical networks, then wavelength division multiplexing can be achieved, but device complexity and alignment precision requirements increase

Engineering Contradiction:
Improvewavelength division multiplexing capabilityVSAvoidnumber of discrete optical components
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent integrates multiple discrete optical components (laser sources, modulators, filters, and combiners) onto a single photonic integrated circuit chip. This merging eliminates the need for separate alignment and coupling of individual components, thereby reducing device complexity while maintaining wavelength division multiplexing functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The photonic integrated circuit chip performs multiple functions simultaneously: generating multiple wavelengths, modulating signals, filtering channels, and combining outputs. This multi-functionality consolidates what would traditionally require separate discrete components into a single universal device.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If discrete optical components with precise alignment are used, then optical signal transmission can be achieved, but manufacturing cost and alignment difficulty increase

Engineering Contradiction:
Improveoptical signal transmission qualityVSAvoidalignment precision requirements
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

By integrating all optical components on a single chip with fixed relative positions, the patent eliminates the need for precise manual alignment during assembly. The components are manufactured in their final positions relative to each other, dramatically easing manufacturing while maintaining transmission quality.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If dispersion compensation and amplification are implemented across different fiber types, then signal quality can be maintained, but data rate and channel density are limited

Engineering Contradiction:
Improvesignal qualityVSAvoiddata rate and channel density
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent employs tunable optical filters and wavelength-selective components that can dynamically adjust transmission parameters. This allows the system to adapt to different fiber types and dispersion conditions while maintaining signal quality, thereby enabling higher data rates and channel densities without being constrained by fiber-specific limitations.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The PIC chip enhances the efficiency and cost-effectiveness of DWDM optical networks by simplifying component integration, reducing alignment complexities, and enabling higher data rates and channel densities within the gain bandwidth of erbium-doped fiber amplifiers.

Implementation Method 1

a wavelength selective combiner having an input optically coupled to received all the channel signal outputs from the modulated sources

Methodology Applied
Scientific EffectDiffraction grating: Diffraction Grating

Data Source

PatentUS7885492B2Transmitter photonic integrated circuit (TxPIC) chips
Publication Date: 2011.02.08 INFINERA CORP
  • US7885492B2 patent drawing
  • US7885492B2 patent drawing
  • US7885492B2 patent drawing

AI summary

A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.