Type III Heterojunction Carrier Diffusion

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Solution Overview

Problem

Traditional p-n junction-based semiconductor devices face limitations due to doping-induced carrier scattering, reduced mobility, and material solubility constraints, which hinder the development of high-conductivity, high-power, and high-frequency devices.

Innovation Solution

The use of type-III heterojunctions with overlapping energy bands, where the valence band maximum of one material is above the conduction band minimum of another, allows for carrier transfer via diffusion without doping, enabling the formation of semi-metallic field-effect transistors and optical modulators with reduced scattering and increased mobility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional p-n junction doping is used to increase carrier concentration, then conductivity is improved, but carrier mobility deteriorates due to Coulomb scattering

Engineering Contradiction:
ImproveconductivityVSAvoidcarrier mobility
Core Design Contradiction:
ReliabilityVSSpeed

Solution Approach 1:

The patent changes the fundamental parameter of carrier introduction from doping (adding impurity atoms) to band alignment engineering (modifying energy band structure). By creating a type-III heterojunction where the valence band maximum of one material is above the conduction band minimum of another, carriers transfer via diffusion rather than doping, achieving high conductivity without Coulomb scattering centers that would reduce mobility.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If doping is used to achieve high carrier concentration, then conductivity increases, but manufacturing complexity and cost increase

Engineering Contradiction:
ImproveconductivityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the doping process entirely from the device fabrication. Instead of introducing dopant atoms through complex ion implantation or in-diffusion processes, the invention uses intrinsic carrier transfer across the heterojunction interface driven by band alignment, thereby removing the need for doping-related manufacturing steps and their associated complexity and cost.

Inventive Principle:
Principle #2Taking out (Extraction)

3Power

If traditional p-n junctions are used for high power applications, then device functionality is maintained, but performance is limited by material solid solubility

Engineering Contradiction:
Improvedevice power handlingVSAvoidcarrier concentration limit
Core Design Contradiction:
PowerVSQuantity of substance

Solution Approach 1:

The patent employs composite material structures consisting of two different semiconductor materials with specifically engineered band alignments. The type-III heterojunction combines materials such that the valence band maximum of one material lies above the conduction band minimum of the other, enabling carrier transfer without doping and achieving carrier concentrations that exceed the solid solubility limits of traditional doped semiconductors, thereby enabling high power applications.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach eliminates Coulomb scattering, enabling high mobility and high power FETs with carrier concentrations beyond conventional solid solubility limits, and opens possibilities for tunable metamaterials and optoelectronic devices with reduced losses and increased efficiency.

Implementation Method 1

carrier transfer via diffusion without doping

Methodology Applied
Scientific EffectCarrier diffusion: Diffusion

Implementation Method 2

dopants, as Coulomb scattering center, results in high scattering with low mobility

Methodology Applied
Scientific EffectCoulomb scattering: Coulomb's Law

Data Source

PatentUS10203526B2Type III hetrojunction—broken gap HJ
Publication Date: 2019.02.12 THE UNIV OF NORTH CAROLINA AT CHAPEL HILL
  • US10203526B2 patent drawing
  • US10203526B2 patent drawing
  • US10203526B2 patent drawing

AI summary

A semiconductor junction may include a first layer and a second layer. The first layer may include a first semiconductor material and the second layer may be deposited on the first layer and may include a second material. The valence band maximum of the second material is higher than a conduction band minimum of the first semiconductor material, thereby allowing a flow of a majority of free carriers across the semiconductor junction between the first and second layers to be diffusive.