3D U-Shaped AESA T/R Module Layout for Air-Cooling and Low Thickness
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Solution Overview
Problem
Traditional AESA systems face challenges with high dimensions, weight, power requirements, and cooling needs, limiting their installation on airborne platforms due to bulky designs and inefficient thermal management.
Innovation Solution
A three-dimensional U-shaped module architecture for AESA systems distributes electronic components on base and side PCBs, forming a U-shaped structure for efficient air-cooling and reduced thickness, weight, and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional AESA architecture with multiple components per T/R module is used, then high performance is achieved, but overall dimensions and thickness increase
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional configuration by folding the PCB at 90-degree angles. This vertical stacking allows multiple T/R modules to be arranged in layers along the thickness direction rather than spreading them out in a single plane, thereby reducing the overall footprint while maintaining component density and performance.
Solution Approach 2:
The patent implements a nested arrangement where multiple T/R modules are stacked vertically within a compact volume. Each folded PCB layer contains additional T/R modules nested within the three-dimensional structure, maximizing the use of available space and reducing the overall AESA thickness while accommodating all necessary components.
2Reliability
If traditional AESA architecture with high component density is used, then high performance is achieved, but weight increases
Solution Approach 1:
By arranging components in three dimensions through PCB folding, the patent reduces the horizontal spread of the AESA while maintaining all necessary components. This vertical integration decreases the overall volume and material required for housing and mounting structures, thereby reducing weight while preserving high component density for performance.
Solution Approach 2:
The patent combines multiple T/R modules and their associated components into integrated folded PCB assemblies. By merging these modules into a compact three-dimensional unit, the patent eliminates redundant mounting structures and housing materials, reducing overall weight while maintaining the necessary component density for high performance.
3Temperature
If traditional AESA architecture with extensive cooling infrastructure is used, then thermal management is achieved, but power consumption and weight increase
Solution Approach 1:
The three-dimensional folded PCB structure creates internal channels and pathways for air flow through the AESA thickness direction. This vertical air flow path enables efficient passive or active cooling by allowing coolant to pass through the heat-generating regions, improving thermal management while reducing the power consumption associated with traditional horizontal cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D U-shaped module architecture reduces AESA thickness, weight, and cooling requirements, enabling easier installation and improved performance with efficient air-cooling and simplified control.
Implementation Method 1
efficient air-cooling
Data Source
AI summary
The invention concerns an active electronically steerable antenna including: a planar or quasi-planar radiating array configured to transmit and/or receive radiofrequency or microwave signals, and a plurality of three-dimensional U-shaped modules, each arranged behind, and coupled to, a respective planar or quasi-planar radiating subarray of N radiating elements arranged in two rows or columns, each of N/2 radiating elements, N being an even integer. Each three-dimensional U-shaped module comprises: a respective base wall; two respective side walls that are orthogonally arranged with respect to the respective base wall so as to form therewith a respective three-dimensional U-shaped structure, and are arranged, each, behind a respective row or column of N/2 radiating elements of the respective planar or quasi-planar radiating subarray; and respective transmit and/or receive electronics distributed on said respective base and side walls and configured to implement N respective transmit and/or receive modules. For each three-dimensional U-shaped module, the respective transmit and/or receive electronics includes: for each respective side wall, N/2 respective transmission and/or reception front-end modules that are mounted on said respective side wall, are coupled to the N/2 radiating elements of the respective row or column of the respective planar or quasi-planar radiating subarray, and are configured to implement power amplifiers, low noise amplifiers, and switches or circulators; and respective base wall electronics mounted on the respective base wall, connected to the N respective transmission and/or reception front-end modules and configured to carry out beam steering functions including signal phase-shifting, and attenuation and/or amplification functions.