3D U-Shaped AESA T/R Module Layout for Thin Air-Cooled Arrays
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Solution Overview
Problem
Traditional Active Electronically Steered Antennas (AESAs) face challenges with high thickness, weight, and power requirements due to the bulky nature of their components, which limits their installation on airborne platforms and increases cooling demands, especially for high-frequency applications where tight lattice spacing is necessary.
Innovation Solution
The introduction of a three-dimensional (3D) U-shaped module architecture for AESAs, where electronic components are distributed on a base and side Printed Circuit Boards (PCBs) forming a U-shape, allowing for efficient air-cooling and reduced thickness, weight, and power consumption, while maintaining high performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional AESA architecture with multiple components per T/R module is used, then high performance is achieved, but thickness and weight increase significantly
Solution Approach 1:
The patent transitions from a planar two-dimensional layout of T/R modules to a three-dimensional configuration where modules are stacked vertically with radiating elements arranged in multiple layers. This dimensional change allows compact integration of multiple components without increasing the footprint area, thereby reducing overall thickness while maintaining performance
Solution Approach 2:
The patent implements a nested structure where T/R modules are integrated within the lattice spacing of radiating elements. Multiple T/R modules are positioned in vertical stacks behind each radiating element or grouped in compact arrangements, allowing components to be nested within the spatial envelope defined by the radiating element array, thus reducing overall thickness
2Reliability
If traditional AESA architecture with high component density is used, then high performance is achieved, but cooling requirements and power consumption increase
Solution Approach 1:
The patent divides the AESA system into modular T/R units with integrated power amplifiers and phase shifters. Each module is independently powered and controlled, allowing for efficient power distribution and reduced overall power consumption. The segmentation enables selective activation of modules based on operational requirements
Solution Approach 2:
The patent employs solid-state power amplifiers with improved power efficiency compared to traditional vacuum tube amplifiers. By changing the amplification technology parameter, the system achieves higher power conversion efficiency, reducing overall power consumption while maintaining high performance
3Measurement precision
If tight lattice spacing is used for high-frequency applications, then performance is improved, but space for electronic components is reduced
Solution Approach 1:
The patent arranges T/R modules in the vertical dimension rather than spreading them horizontally. This allows tight lattice spacing in the horizontal plane for high-frequency operation while accommodating multiple electronic components in vertical stacks behind each radiating element, effectively utilizing the third dimension to resolve the space constraint
Solution Approach 2:
The patent positions different electronic components with optimized local arrangements tailored to their specific requirements. High-frequency components are placed in regions with optimal electromagnetic characteristics, while power-consuming components are positioned for efficient thermal management, maximizing space utilization within the tight lattice structure
4Ease of manufacture
If traditional planar AESA architecture is used, then ease of manufacture is maintained, but thermal management becomes problematic
Solution Approach 1:
The patent implements liquid cooling channels integrated within the T/R module structures and between stacked modules. Coolant flows through these channels to actively remove heat from high-power components, enabling effective thermal management in the compact three-dimensional configuration while maintaining manufacturing feasibility through standardized cooling plate designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables compact, low-cost, and high-performance AESAs with improved thermal management and reduced installation constraints, facilitating their use on various platforms, including unmanned aerial vehicles, by minimizing thickness and weight while maintaining efficient air-cooling and high-power amplifier capabilities.
Implementation Method 1
allowing for efficient air-cooling and reduced thickness, weight, and power consumption
Data Source
Figure 1a~1b
Figure 2~3b
Figure 4a~5b
AI summary
The invention concerns an active electronically steerable antenna (20, 30, 40, 7, 100, 200, 300, 400) including: a planar or quasi-planar radiating array configured to transmit and/or receive radiofrequency or microwave signals, and a plurality of three-dimensional U-shaped modules (1, 2, 3, 5, 81, 82, 301), each arranged behind, and coupled to, a respective planar or quasi-planar radiating subarray of N radiating elements (502) arranged in two rows or columns, each of N/2 radiating elements (502), N being an even integer. Each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) comprises: a respective base wall (11, 57); two respective side walls (12, 13, 51) that are orthogonally arranged with respect to the respective base wall (11, 57) so as to form therewith a respective three-dimensional U-shaped structure, and are arranged, each, behind a respective row or column of N/2 radiating elements (502) of the respective planar or quasi-planar radiating subarray; and respective transmit and/or receive electronics distributed on said respective base (11, 57) and side walls (12, 13, 51) and configured to implement N respective transmit and/or receive modules. For each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301), the respective transmit and/or receive electronics includes: for each respective side wall (12, 13, 51), N/2 respective transmission and/or reception front-end modules (59, 6) that are mounted on said respective side wall (12, 13, 51), are coupled to the N/2 radiating elements (502) of the respective row or column of the respective planar or quasi-planar radiating subarray, and are configured to implement power amplifiers (121, 131, 92), low noise amplifiers (122, 132, 93), and switches or circulators (122, 132, 91); and respective base wall electronics mounted on the respective base wall (11, 57), connected to the N respective transmission and/or reception front-end modules (59, 6) and configured to carry out beam steering functions including signal phase-shifting, and attenuation and/or amplification functions.