U-Shaped Induction Loop for Targeted Soldering on Glass Conductors
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Solution Overview
Problem
Existing inductive soldering methods face challenges in efficiently and gently heating solder connections on glass panes with electrical conductor structures, often causing damage to the conductor structures and panes due to indirect and non-targeted heating.
Innovation Solution
A method utilizing an induction loop with a metal profile, featuring U-shaped areas and a non-locally closed design, which focuses the magnetic induction field directly onto the contact element to heat the solder joint, minimizing heat transfer to the conductor structure and pane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional induction coil is used for soldering, then the solder joint can be heated, but the heat is not targeted and causes damage to the conductor structure and pane
Solution Approach 1:
The induction loop is designed with a specific geometry (U-shaped or V-shaped cross-section) that concentrates the magnetic field and induced currents locally at the contact element and solder joint, rather than distributing heat broadly. This localized field concentration enables precise heating of only the intended area, avoiding damage to surrounding conductor structures and the glass pane.
Solution Approach 2:
The contact element acts as an intermediary that receives the magnetic field from the induction loop and converts it into localized heat through eddy currents and hysteresis losses. This intermediary mechanism ensures that heat is generated precisely where needed (at the contact element and solder joint) rather than being applied broadly to the entire conductor structure or pane.
2Use of energy by moving object
If indirect heating methods are used, then the solder joint can be heated, but energy efficiency is reduced and damage occurs
Solution Approach 1:
The patent replaces indirect mechanical or thermal heating methods with direct electromagnetic induction heating. The induction loop generates a magnetic field that directly induces eddy currents in the contact element, converting electromagnetic energy directly into heat at the target location. This eliminates energy losses associated with indirect heating methods and prevents heat from damaging surrounding areas.
Solution Approach 2:
The induction loop geometry (U-shaped or V-shaped cross-section) is specifically designed to optimize the distribution and concentration of magnetic flux density and induced currents. By adjusting the loop's cross-sectional parameters, the system achieves maximum energy efficiency in heating the solder joint while minimizing heat spread to surrounding areas, thus preventing damage.
3Ease of manufacture
If a closed coil induction loop is used, then the structure is complete, but it is complex and not easily manufactured
Solution Approach 1:
The induction loop is segmented into a simple linear or bent profile shape rather than being a complete closed coil. This segmentation simplifies the manufacturing process, allowing the loop to be easily formed from a single piece of conductive material through bending or shaping, while still generating the necessary magnetic field for effective induction heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables targeted and energy-efficient heating of solder joints, reducing damage to the conductor structures and panes while ensuring consistent high-quality soldering by using a focused magnetic field and adjustable frequency induction generator.
Implementation Method 1
a magnetic field with a predetermined frequency is emitted into the contact element from a soldering tool comprising an electrically powered induction loop in order to heat it by induction and melt the solder deposit adjacent to it
Implementation Method 2
heat it by induction
Implementation Method 3
heat it by induction and melt the solder deposit
Data Source
Figure 1
Figure 2
Figure 3A~4
AI summary
The invention relates to a soldering tool (13) for inductive soldering, comprising an induction loop (13I) and an induction generator (G), which is electrically connected to the induction loop (13I), wherein the induction loop (13I) consists of a metal profiled element, preferably a metal full or hollow profiled element, and has at least one U-shaped region (13U) or two U-shaped regions (13U), each U-shaped region (13U) having two legs (13P) and an end region (13E), which connects the legs (13P), the at least one U-shaped region (13U) having a length (L) of at least 3 mm to preferably 500 mm and a width (B) of 2 mm to 30 mm.