U-Shaped Socket for Semiconductor Module Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The thickness of notebooks and other personal computing devices is limited by the height of the memory module assembly, which includes the thickness of the socket, making it difficult to reduce the overall thickness of these devices.
Innovation Solution
A semiconductor module assembly design that includes a motherboard with an opening for a socket, where the socket is disposed along three sides, allowing the semiconductor module to be electrically connected through conductive lines and fixing/supporting portions, with no portion of the socket overlapping the motherboard or module board, thereby minimizing the overall height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a memory module is installed at a socket mounted on a motherboard, then the memory module can be electrically connected and mechanically supported, but the thickness of the notebook is increased due to the socket thickness
Solution Approach 1:
The socket is designed with a U-shaped configuration that extends along three sides of the opening in the motherboard, utilizing the lateral dimensions rather than extending vertically. This dimensional redistribution allows the socket to provide electrical connection and mechanical support without increasing the vertical thickness of the notebook.
Solution Approach 2:
The socket is disposed within the opening of the motherboard, with portions of the socket overlapping the motherboard in the plan view but not extending below it. The semiconductor module is then disposed within the socket, creating a nested arrangement where the socket is embedded in the motherboard's opening, minimizing overall height.
2Length of moving object
If the socket is disposed along three sides of the opening, then the height from motherboard to memory module is reduced, but the electrical connection complexity increases
Solution Approach 1:
Each side of the U-shaped socket serves multiple functions: it provides electrical connection through conductive lines, mechanical support through the fixing portion, and structural integrity. This multi-functionality reduces the need for separate components and simplifies the overall electrical connection system despite the unconventional three-sided configuration.
3Length of moving object
If no portion of the socket overlaps the motherboard below the opening, then the overall thickness is minimized, but the socket's mechanical stability is reduced
Solution Approach 1:
The socket is designed with asymmetric overlapping: it overlaps the motherboard above the opening for electrical connection and support, but deliberately does not overlap below the motherboard. This asymmetric configuration provides sufficient mechanical stability through the three-sided support structure while minimizing overall thickness.
Data Source
AI summary
A semiconductor module assembly is provided. The semiconductor module assembly includes a motherboard, a socket, and a semiconductor module. The motherboard includes an opening for receiving the semiconductor module, the opening including at least three sides. The socket is disposed in the opening along at least a first side, second side, and third side of the at least three sides. The semiconductor module is disposed in the socket. The semiconductor module includes at least one semiconductor device mounted on a module board. The socket includes at least a first side along the first side of the opening, and a second side along the second side of the opening, and the semiconductor module electrically connects to the motherboard through at least the first and second sides of the socket.