Configurable U-Turn Circuitry for IC Intra-Layer Routing
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Solution Overview
Problem
Integrated circuit (IC) devices with vertically stacked IC chips often have unused or underutilized inter-layer connection circuitry, which can lead to inefficiencies in both 3D stacked and 2D applications.
Innovation Solution
The implementation of configurable interface circuitry that reroutes inter-layer connection circuitry to provide intra-layer connections, utilizing multiplexer circuits to selectively route nodes between functional circuitry, thereby repurposing unused connections and improving connectivity and logic utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If inter-layer connection circuitry is used for vertical connections between stacked IC chips, then 3D stacking capability is achieved, but the inter-layer connection circuitry remains unused or underutilized in 2D applications
Solution Approach 1:
The inter-layer connection circuitry is designed to perform multiple functions: it can operate as vertical inter-layer connections when IC chips are stacked in 3D configurations, and as intra-layer horizontal connections when chips are used in 2D configurations. This multi-functionality is achieved through configurable interface circuitry that can route signals differently based on the stacking configuration, ensuring full utilization of the connection resources regardless of whether the device is deployed in 3D or 2D mode.
2Adaptability or versatility
If dedicated intra-layer connection circuitry is added to improve routing flexibility, then design routability is enhanced, but device complexity and area increase
Solution Approach 1:
The patent merges the inter-layer connection circuitry with the intra-layer connection functionality by configuring existing vertical connection resources to also serve as horizontal connections within the layer. Instead of adding separate dedicated intra-layer connection circuitry, the same physical connection structures are made programmable and reconfigurable, allowing them to function as either inter-layer or intra-layer connections based on configuration settings, thereby avoiding additional hardware overhead.
Solution Approach 2:
The connection circuitry is made dynamic and reconfigurable through programmable interface circuitry that can change its routing behavior based on the operational mode (3D stacking or 2D configuration). This dynamic reconfiguration capability allows the system to adapt the connection topology as needed without requiring multiple fixed dedicated circuits, reducing overall device complexity while maintaining routing flexibility.
Data Source
AI summary
An integrated circuit (IC) device includes a block of integrated circuitry that includes functional circuitry and configurable interface circuitry. The configurable interface circuitry includes output circuitry that routes a node of the functional circuitry to an output node of the block, and input circuitry that selectively routes the output node of the block or an input node of the block to the functional circuitry. The output circuitry may route a selectable subset of multiple nodes of the functional circuitry to respective output nodes of the block, and the input circuitry may be configured to route the output nodes of the block back to the functional circuitry in the absence of an adjacent block (e.g., to repurpose the output circuitry), or in addition to interfacing with the adjacent block.