Circuit Board Thermal Isolation for UAV Inertial Measurement
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Solution Overview
Problem
Inertial measurement units in circuit boards are compromised by thermal stress from heat-generating components, affecting measurement precision in applications like unmanned aerial vehicles.
Innovation Solution
A circuit board design with a main body part and an isolated peripheral part, where the micro-control unit is supported on the main body and the inertial measurement unit is isolated on the peripheral, reducing thermal stress impact through strategic placement and wiring connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the inertial measurement unit is placed on the main body part of the circuit board, then the device complexity is reduced, but the measurement precision deteriorates due to thermal stress from heat-generating components
Solution Approach 1:
The circuit board is divided into two distinct parts: a main body part for mounting heat-generating components and an isolated part for mounting the inertial measurement unit. This segmentation physically separates the inertial measurement unit from thermal sources, reducing thermal stress impact while maintaining structural integrity through the board's overall framework.
Solution Approach 2:
The inertial measurement unit is extracted from the main body part and relocated to a separate isolated part of the circuit board. This extraction removes the sensitive inertial measurement unit from the thermal environment created by heat-generating components, thereby preserving measurement precision without requiring complete redesign of the entire board.
2Measurement precision
If the inertial measurement unit is isolated on the peripheral part, then the measurement precision is improved by reducing thermal stress, but the device complexity increases
Solution Approach 1:
Different regions of the circuit board are assigned different functional qualities: the main body part accommodates heat-generating components with higher thermal tolerance, while the isolated peripheral part provides a thermally stable environment for the inertial measurement unit. This local differentiation optimizes each region for its specific function without requiring complete system redesign.
Solution Approach 2:
The circuit board transitions from a single-plane structure to a multi-region structure with distinct functional zones. By utilizing the spatial dimension of the board and creating isolated peripheral regions, the design achieves thermal separation without significantly increasing overall complexity, as the separation is achieved through planar zoning rather than adding three-dimensional components.
Data Source
AI summary
A circuit board includes a board body including a wiring; a micro-control unit, arranged on the board body; and an inertial measurement unit arranged on the board body and in communication with the micro-control unit via the wiring to transmit inertial measurement data detected by the inertial measurement unit to the micro-control unit, and where the board body includes a main body part and an isolated part located at a peripheral of the main body part, the micro-control unit is supported on the main body part, and the inertial measurement unit is supported on the isolated part.