UAV Detachable Avionics and Central Board Assembly

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Solution Overview

Problem

Current unmanned aerial vehicles (UAVs) face challenges in disassembly and maintenance due to the exposure and integration of avionics and central board systems on a single circuit board, making repair and replacement cumbersome and costly.

Innovation Solution

The UAV design features a detachable avionics board assembly mounted on one side of the frame and a central board assembly mounted on top, spaced apart and connected via wires for power and communication signals, allowing for separate maintenance and replacement of individual components, with heat dissipation fins and shock absorbers for improved performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the avionics system and central board main body are integrated on a single circuit board, then the device complexity is reduced, but the ease of repair deteriorates

Engineering Contradiction:
Improvecircuit board integrationVSAvoidmaintenance difficulty
Core Design Contradiction:
Device complexityVSEase of repair

Solution Approach 1:

The patent divides the integrated circuit board into separate functional modules: avionics board assembly and central board assembly. Each module can be independently removed and replaced, transforming a monolithic difficult-to-maintain system into modular units that simplify repair operations while maintaining system integration benefits

Inventive Principle:
Principle #1Segmentation

2Device complexity

If the avionics board assembly and central board assembly are mounted close together, then the device complexity is reduced, but the heat dissipation performance deteriorates

Engineering Contradiction:
Improveassembly arrangementVSAvoidheat dissipation
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent positions the avionics board assembly on the side of the frame and the central board assembly on top of the frame, utilizing three-dimensional spatial arrangement rather than planar proximity. This vertical and lateral separation creates adequate thermal zones for heat dissipation while maintaining electrical connectivity through wires, solving the heat management issue without excessive complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If the circuit board is exposed and mounted in the housing, then the ease of manufacture is improved, but the reliability deteriorates due to vibration and environmental exposure

Engineering Contradiction:
Improvemounting simplicityVSAvoidvibration resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent nests the avionics board assembly and central board assembly within dedicated housings or mounting structures that are themselves mounted in the UAV frame. This nested arrangement provides protective enclosures for the circuit boards, shielding them from vibration and environmental factors while maintaining accessible mounting for manufacturing and maintenance purposes

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS20210237869A1Unmanned aerial vehicle
Publication Date: 2021.08.05 SZ DJI TECH CO LTD
  • US20210237869A1 patent drawing
  • US20210237869A1 patent drawing
  • US20210237869A1 patent drawing

AI summary

An unmanned aerial vehicle includes a frame, an avionics board assembly detachably mounted at a side of the frame, and a central board assembly detachably mounted at a top of the frame, spaced apart from the avionics board assembly, electrically connected to the avionics board assembly via a wire, and used to transfer at least one of a power signal or a communication signal. The avionics board assembly includes a flight controller used to control flight status of the unmanned aerial vehicle, and a positioning navigation device electrically connected to the flight controller and used to obtain current position information of the unmanned aerial vehicle.