UAV Frame Assembly with Segmented Circuit Board Access
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Solution Overview
Problem
The existing configuration of UAVs with stacked circuit boards limits effective usage area and complicates maintenance, as the upper circuit board must be disassembled to access the lower one, and heat dissipation is poor due to the stacked arrangement.
Innovation Solution
A frame assembly for UAVs with a housing having separate upper and lower openings for independently mounting two circuit boards, allowing for flexible assembly sequence and improved heat dissipation by spacing them apart and using separate covers for each.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If two circuit boards are sequentially installed in the UAV housing from top to bottom to save space, then the space utilization is improved, but the maintenance convenience deteriorates as the upper circuit board must be disassembled first to access the lower one
Solution Approach 1:
The patent divides the housing into separate upper and lower chambers, each independently accommodating a circuit board. The upper chamber has an upper opening for accessing the first circuit board, while the lower chamber has a lower opening for accessing the second circuit board. This segmentation allows independent maintenance of each circuit board without disassembling other components, resolving the contradiction between space utilization and maintenance convenience.
2Area of stationary object
If two circuit boards are sequentially installed in the UAV housing from top to bottom to save space, then the space utilization is improved, but the effective usage area of the lower circuit board deteriorates due to the positioning post passing through it
Solution Approach 1:
The patent segments the housing into distinct upper and lower chambers with separate openings. The lower chamber provides an independent lower opening for installing the second circuit board, eliminating the need for a positioning post to pass through the circuit board. This ensures the entire surface area of the lower circuit board remains effectively usable while maintaining compact space utilization.
3Device complexity
If two circuit boards are sequentially installed in the UAV housing from top to bottom, then the device complexity is reduced, but the heat dissipation performance deteriorates
Solution Approach 1:
The patent divides the housing into separate upper and lower chambers with independent openings and spacing between circuit boards. This segmentation creates thermal separation that improves heat dissipation for both circuit boards while maintaining relatively simple assembly procedures. Each chamber can be independently accessed and managed, balancing device complexity with thermal performance.
Data Source
AI summary
The present disclosure provides a frame assembly for an unmanned aerial vehicle. The frame assembly comprises a housing having an electric chamber and a circuit board assembly disposed in the electric chamber and including a first circuit board and a second circuit board. The electric chamber has an upper opening and a lower opening; and the first circuit board is installed in the electric chamber via the upper opening, and the second circuit board is installed in the electric chamber via the lower opening and spaced apart from the first circuit board.