UAV Heat Dissipation Device with Segmented Air Ducts
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Solution Overview
Problem
In unmanned aerial vehicles (UAVs), the heat generated by electronic modules can lead to increased environmental temperatures within the compact main control system, potentially causing operational issues due to differing thermal requirements among modules, such as the inertial measurement unit (IMU) and orthogonal frequency-division multiplexing (OFDM) modules.
Innovation Solution
A heat dissipation device comprising an air guiding cover with an air duct, a heat conduction plate, and a fan, which guides airflow to separate and dissipate heat from each module efficiently, preventing heat interference and ensuring modules operate within optimal temperature ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If modules are deployed in an integral space to reduce mass and volume, then the compactness of the main control system is improved, but the heat dissipation capability deteriorates due to closed space preventing timely heat dissipation
Solution Approach 1:
The patent divides the main control system into separate modules (IMU module, OFDM module, etc.), each with its own heat dissipation path. The air guiding cover creates independent air channels for different modules, allowing heat from each module to be dissipated separately through dedicated airflow paths, thus resolving the contradiction between compact integration and effective heat dissipation.
2Volume of moving object
If modules are arranged in a closed space to reduce volume, then the compactness is improved, but the thermal isolation between modules deteriorates causing heat interference
Solution Approach 1:
The air guiding cover segments the internal space into distinct air channels, each serving specific modules. This segmentation creates thermal isolation between modules while maintaining their physical integration, preventing heat from high-power modules (like OFDM) from interfering with sensitive modules (like IMU).
Solution Approach 2:
Different modules are provided with different heat dissipation characteristics through the air guiding cover design. High-heat modules receive dedicated airflow paths with appropriate cooling capacity, while low-heat modules have corresponding dissipation paths, creating localized thermal management solutions tailored to each module's heat generation characteristics.
3Temperature
If air channels are added for heat dissipation, then the heat dissipation capability is improved, but the structural complexity increases
Solution Approach 1:
The air guiding cover merges multiple functions into a single integrated component: it serves as both the housing structure for modules and the heat dissipation system. The air channels are formed directly within the cover structure itself, combining structural support and thermal management functions, thus improving heat dissipation without proportionally increasing overall system complexity.
Solution Approach 2:
The air guiding cover is designed as a multi-functional component that simultaneously provides mechanical support for modules, creates sealed compartments for thermal isolation, and forms airflow channels for heat dissipation. This universal design approach allows a single component to address multiple requirements, reducing the need for additional separate heat dissipation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation device effectively separates and dissipates heat from various electronic modules, maintaining optimal operating temperatures and enhancing the structural integrity and reliability of the UAV by preventing heat interference and ensuring secure electrical contact during flight.
Implementation Method 1
a heat conduction plate, which is fixed on the air guiding cover and covers the mounting window
Implementation Method 2
an air duct configured to guide an airflow and including a mounting window formed on a sidewall of the air duct
Data Source
AI summary
A heat dissipation device includes an air guiding cover and a heat conduction plate. The air guiding cover includes an air duct configured to guide an airflow and including a mounting window formed on a sidewall of the air duct, an air inlet formed at a first end of the air duct, and an air outlet formed at a second end of the air duct. The heat conduction plate is disposed at the mounting window and covers the mounting window.