Redistribution Layer UBM Layout to Reduce Package Warpage

The patent extracts and removes the unnecessary upper horizontal structure and additional via structures from the conventional T-type UBM configuration. By taking out these redundant elements, the patent achieves the same adhesion improvement function without the additional manufacturing steps, thereby reducing manufacturing time and cost while maintaining the core benefit of preventing UBM side surface peeling.

The patent makes the UBM wire line perform multiple functions: it serves as both the adhesion-improving structural element and as an electrical connection path (wire line) simultaneously. This multi-functionality eliminates the need for separate upper structures and additional vias, reducing manufacturing complexity while achieving both adhesion improvement and electrical connectivity.

The patent removes the redundant upper horizontal structure and additional via structures from the conventional T-type UBM design. By extracting these unnecessary elements, the patent reduces the number of manufacturing steps and materials required, thereby lowering manufacturing cost while maintaining the essential adhesion improvement function through the simplified UBM wire line configuration.

The UBM wire line is designed to serve dual purposes: improving adhesion between the UBM and dielectric layer while simultaneously functioning as an electrical wire line. This multi-functionality eliminates the need for separate structural and conductive elements, reducing manufacturing complexity and cost while achieving both objectives.

The patent extracts and removes the upper horizontal structure and additional via structures that contribute to increased thickness of the front side redistribution layer. By taking out these redundant elements, the patent reduces the overall thickness, thereby minimizing thickness differences between front and back sides and preventing warpage in package-on-package structures while maintaining adhesion improvement through the essential UBM wire line.

The UBM wire line performs multiple functions in a single integrated structure: it provides adhesion improvement, serves as an electrical connection path, and maintains a compact thickness profile. This multi-functional design eliminates the need for separate upper structures that would increase thickness and cause warpage, achieving adhesion improvement without compromising package flatness.