UCIe Die-to-Die Interface for Multi-Protocol Chiplet Interoperability
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Solution Overview
Problem
Legacy die-to-die (D2D) interconnects lack interoperability and do not provide a mechanism for seamless interoperability between dies, often being vendor-specific or application-specific, and do not support ubiquitous load-store input/output protocols, limiting innovation and integration flexibility.
Innovation Solution
A general-purpose D2D interconnect, referred to as Universal Chiplet Interconnect express (UCIe), which supports multiple communication protocols (PCIe and CXL) and includes a layered protocol stack with a die-to-die adapter and physical layer, enabling seamless interoperability and allowing vendors to mix and match components from different providers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If legacy vendor-specific D2D interconnects are used, then implementation simplicity is maintained, but interoperability between dies from different vendors is lost
Solution Approach 1:
The patent creates a universal D2D interconnect interface that can work with dies from different vendors and support multiple protocols (PCIe, CXL, HBM). The interface defines standardized physical layer, link layer, and protocol layers that enable any compliant die to interoperate with any other compliant die, eliminating vendor lock-in while maintaining implementation simplicity through standardized building blocks.
2Adaptability or versatility
If application-specific D2D interconnects are used, then optimization for specific applications is achieved, but flexibility for general-purpose use is reduced
Solution Approach 1:
The interconnect interface is segmented into distinct layers: physical layer (signal transmission), link layer (data link management), and protocol layers (PCIe, CXL, HBM). This segmentation allows each layer to be independently implemented and optimized, enabling manufacturers to choose which protocol layers to implement based on application needs while maintaining a standardized physical and link layer for ease of integration.
Solution Approach 2:
The interface design allows dynamic selection and configuration of protocol layers based on application requirements. The standardized base layers remain fixed for manufacturing simplicity, while upper protocol layers can be dynamically configured or selected to match specific application needs, providing both flexibility and ease of manufacture.
3Adaptability or versatility
If proprietary D2D interconnects are used, then vendor control is maintained, but ecosystem innovation and IP provider diversity are limited
Solution Approach 1:
The standardized D2D interconnect interface acts as an intermediary layer between proprietary IP cores and the physical transmission medium. This intermediary defines clear boundaries and standardized interfaces that allow multiple IP providers to develop compliant dies without needing to negotiate proprietary interfaces, fostering ecosystem innovation while managing complexity through standardization.
Data Source
AI summary
In one embodiment, a first die comprises: a first die-to-die adapter to communicate with first protocol layer circuitry via a flit-aware die-to-die interface (FDI) and first physical layer circuitry via a raw die-to-die interface (RDI), where the first die-to-die adapter is to receive message information comprising first information of a first interconnect protocol; and the first physical layer circuitry coupled to the first die-to-die adapter. The first physical layer circuitry may be configured to receive and output the first information to a second die via an interconnect, the first physical layer circuitry comprising a plurality of modules, each of the plurality of modules comprising an analog front end having transmitter circuitry and receiver circuitry. Other embodiments are described and claimed.