UCIe Chiplet Sideband Switching for Thermal Hotspot Reduction
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Solution Overview
Problem
The Universal Chiplet Interconnect Express (UCIe) specification limits sideband configurations to a single active sideband in multi-module configurations, leading to thermal hotspots and increased latency in data communication, particularly in 2.5D and 3D packaging technologies.
Innovation Solution
Enables runtime configuration of sidebands in multi-module chiplets by selecting a different sideband than the single active sideband and/or aggregating one or more additional sidebands, reducing hardware stress and improving data integrity by changing or adding active sidebands during UCIe link training.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single active sideband is configured in multi-module chiplet configurations, then the system follows the UCIe specification, but thermal hotspots and increased latency occur in data communication
Solution Approach 1:
The patent implements dynamic sideband selection and aggregation mechanisms that allow the system to transition from a static single-active-sideband configuration to a dynamic multi-sideband configuration. The sideband aggregation logic dynamically activates multiple sidebands based on communication needs, distributing thermal load and reducing hotspots while maintaining data communication reliability.
Solution Approach 2:
The patent merges multiple sidebands into an aggregated sideband configuration, combining the functionality of multiple individual sidebands. This aggregation allows data communication to utilize multiple physical sideband channels simultaneously, distributing thermal stress across multiple channels while maintaining reliable communication, thus resolving the contradiction between reliability and thermal management.
2Reliability
If a single active sideband is used in multi-module chiplet configurations, then the system adheres to current UCIe specifications, but latency in data communication increases
Solution Approach 1:
The system dynamically selects and aggregates sidebands based on communication requirements. When low latency is needed, the system activates multiple sidebands in aggregation mode, providing parallel communication paths that reduce latency while maintaining reliability through redundant pathways.
Solution Approach 2:
The patent adds a temporal dimension to sideband utilization by implementing runtime reconfiguration capabilities. The system can switch between single-sideband and multi-sideband aggregation modes during operation, adding the dimension of time-based adaptability to resolve the latency-reliability tradeoff by optimizing the configuration based on real-time communication demands.
3Temperature
If multiple sidebands are activated simultaneously, then thermal hotspots and latency are reduced, but the system deviates from current UCIe specification limitations
Solution Approach 1:
The patent implements dynamic sideband configuration that adapts to thermal conditions and communication needs. The system monitors thermal hotspots and communication latency, then dynamically adjusts the number and configuration of active sidebands, providing thermal management and performance optimization while maintaining specification compliance through conditional adaptability.
Solution Approach 2:
The system changes the operational parameters of sideband configuration from a fixed single-active-state to a variable multi-state configuration. By adjusting parameters such as the number of active sidebands, aggregation mode, and selection criteria based on thermal and performance conditions, the system achieves thermal management and latency reduction while maintaining adaptability to different operating scenarios.
4Device complexity
If sideband configuration is fixed during initialization, then the system is simpler to implement, but it cannot adapt to runtime thermal and performance conditions
Solution Approach 1:
The patent introduces dynamic reconfiguration capabilities that allow the sideband configuration to change during runtime based on thermal conditions and communication performance. The system maintains a relatively simple initialization process while adding runtime adaptability through monitoring and dynamic adjustment mechanisms, balancing complexity and reliability.
Solution Approach 2:
The system implements feedback mechanisms that monitor thermal conditions, communication latency, and sideband performance in real-time. Based on this feedback, the system dynamically adjusts sideband configuration to optimize reliability, adding intelligence to the configuration process without significantly increasing hardware complexity. The feedback loop enables adaptive optimization while maintaining implementation simplicity.
Data Source
AI summary
Various embodiments include methods and devices for implementing Universal Chiplet Interconnect Express (UCIe) link configuration for multi-module chiplets of a computing device. Embodiments may include transitioning a UCIe link in an active state having a first sideband that is active to the UCIe link in a reset state, and initializing at least one sideband for the UCIe link that is a different functional sideband of a multi-module chiplet than the first sideband following the reset state of the UCIe link. Embodiments may include reading sideband data configured to represent a functional sideband of the multi-module chiplet, and initializing the functional sideband as the at least one sideband. Embodiments may include reading sideband data configured to represent at least two functional sidebands of the multi-module chiplet, and initializing at least one functional sideband of the at least two functional sidebands as the at least one sideband.