UEFI Thermal Module for Cross-Component Power and Heat Control
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Solution Overview
Problem
Computing devices face challenges in managing thermal energy generated by electronic components, which can lead to damage when performance is increased, as existing systems are often manufacturer-specific and require time-consuming programming.
Innovation Solution
A thermal module that communicates with various components via a unified extensible firmware interface (UEFI) to detect and configure interfaces, allowing dynamic communication and control, independent of component provenance, to manage thermal and power settings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manufacturer-specific thermal management systems are used, then control precision for specific components is improved, but device complexity and programming time increase
Solution Approach 1:
The patent implements a universal thermal management interface that can communicate with multiple different component types from various manufacturers through a standardized protocol. The thermal module uses a common interface definition that works across different hardware platforms, eliminating the need for manufacturer-specific programming while maintaining effective thermal control.
Solution Approach 2:
The thermal management system is divided into independent interface definitions and component-specific implementations. The core thermal control logic is separated from hardware-specific details, allowing the system to maintain precision through modular interface definitions while reducing overall complexity through reusable components.
2Productivity
If performance of electronic components is increased, then computing capability is improved, but thermal energy generation increases causing potential damage
Solution Approach 1:
The thermal management system continuously monitors thermal conditions and dynamically adjusts component performance settings based on real-time temperature data. When thermal thresholds are approached, the system automatically reduces performance parameters to prevent damage, creating a closed-loop control system that balances performance with thermal safety.
Solution Approach 2:
The system dynamically adjusts performance parameters based on thermal conditions rather than using fixed settings. Performance levels are modifiable in real-time according to thermal state, allowing the system to maximize computing capability when cool and reduce performance when thermal limits are approached, preventing damage while optimizing productivity.
3Adaptability or versatility
If dynamic communication with components is enabled, then adaptability to component changes is improved, but interface configuration complexity increases
Solution Approach 1:
The thermal management system automatically detects available components and configures interfaces without requiring manual programming. The system queries the hardware environment, identifies supported components, and sets up communication parameters autonomously, providing adaptability to different configurations while keeping the user experience simple.
Data Source
AI summary
A method of thermal and power control in a computing device includes, at the computing device, initializing a thermal module of the computing device, receiving data at the thermal module from a first component assigned to an interface of the thermal module, and sending an output to a second component from the thermal module based on the data. Initializing the thermal module includes detecting a presence of a plurality of potential components of the computing device; querying each of the plurality of potential components to determine capabilities of each component; in response to the querying, for each of at least a subset of the plurality of potential components receiving identification information for the component and, based on the received identification information, configuring one or more interfaces of the plurality of predefined interfaces of the thermal module to establish communication with the subset of components.