Ultra Dense Server Vertical Stacking and Nesting
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Solution Overview
Problem
Traditional server designs face challenges in integrating a greater quantity of features such as processors, memory, cooling fans, input/output components, and power supply in a compact space without wasting space or requiring excessive cabling.
Innovation Solution
The server design minimizes wasted space by arranging components such that the cooling fan assembly is at one end, the input/output assembly at the other, with the processor assembly and power supply assembly in between, and electrically connecting them to reduce cable length and optimize component placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are arranged in traditional server configurations, then ease of manufacture and standardization are maintained, but space utilization deteriorates and wasted space increases
Solution Approach 1:
The patent transitions from traditional horizontal component arrangement to a vertical three-dimensional configuration. The processor assembly is positioned vertically above the motherboard, with the cooling fan assembly stacked above the processor assembly, utilizing the vertical dimension to maximize space utilization within the server chassis while reducing the server's footprint.
Solution Approach 2:
The patent implements nested positioning where the processor assembly is contained within the vertical space defined by the cooling fan assembly above and the motherboard below. The cover plate assembly further nests by covering both the processor assembly and cooling fan assembly, creating a compact integrated unit that minimizes wasted space.
2Volume of moving object
If component integration is increased to reduce space, then space utilization improves, but device complexity and cabling requirements increase
Solution Approach 1:
The patent merges the processor assembly, cooling fan assembly, and cover plate assembly into a tightly integrated vertical unit. The processor assembly is positioned directly above the motherboard with minimal spacing, and the cooling fan assembly is stacked above the processor assembly, creating a compact configuration that reduces the need for extensive cabling while maintaining functional independence of each component.
3Volume of moving object
If minimal spacing between components is used, then space utilization improves, but heat dissipation and cooling efficiency may worsen
Solution Approach 1:
The patent utilizes vertical stacking to achieve minimal horizontal spacing while maintaining adequate vertical clearance for thermal management. The cooling fan assembly is positioned directly above the processor assembly in the vertical dimension, creating an efficient thermal pathway where hot air rises naturally from the processor to the cooling fans, enabling effective heat dissipation despite compact horizontal footprint.
Data Source
AI summary
A server including a cooling fan assembly and an input/output assembly at opposite ends of the server, and a processor assembly located between the cooling fan assembly and input/output assembly. The server also includes a cover plate that covers the processor assembly and cooling fan assembly and that has a power supply on the face of the cover plate facing the processor assembly and is electrically connected to the processor assembly.