Ultra-light Epoxy Composition for Aerospace Abradable Coatings
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Solution Overview
Problem
Current abradable coatings and fillers in aerospace and other industries face challenges in meeting demanding requirements for temperature resistance, humidity tolerance, low weight, and ease of application, particularly in terms of extrudability and pumpability, while also needing to be sandable and fire-resistant.
Innovation Solution
A low-density curable two-part epoxy composition comprising a polymeric diamine, epoxy resin, reactive diluent, and amide waxes, with optional fire retardants, that can be extruded and cured at ambient temperatures, providing a combination of good mechanical strength, sandability, and resistance to high temperatures and humidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional abradable coatings and fillers are used to achieve temperature resistance and fire retardancy, then reliability is improved, but weight increases and ease of operation deteriorates
Solution Approach 1:
The patent changes the density parameter of the filler material from conventional heavy fillers to lightweight fillers with density less than 0.3 g/cc, achieving cured composition density less than 0.5 g/cc. This parameter change maintains fire retardancy and temperature resistance while significantly reducing weight.
Solution Approach 2:
The patent uses composite materials combining epoxy resin with polymeric diamine curing agent and lightweight filler materials. This composite approach achieves the desired balance of fire resistance, mechanical strength, and low weight that conventional single-material coatings cannot provide.
2Ease of manufacture
If pasteous compositions are used for filling applications, then ease of manufacture is improved, but ease of operation deteriorates due to poor extrudability and pumpability
Solution Approach 1:
The patent changes the viscosity and rheological parameters of the composition by selecting specific epoxy resin viscosities and filler particle size distributions. This enables the composition to be pumpable and extrudable while maintaining filling capability, resolving the contradiction between ease of manufacture and ease of operation.
3Strength
If high-density filler materials are used to achieve mechanical strength, then strength is improved, but weight increases and sandability deteriorates
Solution Approach 1:
The patent changes the density parameter of fillers to less than 0.3 g/cc while optimizing filler loading and particle morphology to maintain mechanical strength. The lightweight fillers also improve sandability compared to conventional high-density fillers, achieving both strength and low weight simultaneously.
4Ease of operation
If ambient temperature curing is used to improve ease of operation, then ease of operation is improved, but temperature resistance may deteriorate
Solution Approach 1:
The patent uses a composite curing system with polymeric diamine that enables ambient temperature curing while maintaining high temperature resistance in the cured state. The epoxy-resin-polymeric diamine combination provides both easy handling and excellent thermal performance.
Solution Approach 2:
The patent changes the curing temperature parameter from elevated temperature to ambient temperature by selecting appropriate curing agents, while the resulting cured network structure maintains temperature resistance through cross-linking density and chemical composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition offers improved handling and application properties, including ease of extrusion and pumping, excellent sandability, and fire resistance, making it suitable for lightweight aerospace and automotive applications without the need for additional heating during curing.
Implementation Method 1
a first part (A) comprising: (i) at least one polymeric diamine: (b) a second part (B) comprising: (i) at least one epoxy resin
Implementation Method 2
at least one reactive diluent
Implementation Method 3
at least one amide selected from polyamide waxes
Implementation Method 4
part (A) and/or part (B) comprise a low density filler material having a density of less than 0.3 g/cc; and wherein the curable composition obtained by combining part (A) and part (B) has a cured density according to DIN 53479A of less than 0.5 g/cc
Data Source
AI summary
In one aspect of the present disclosure, there is provided a low-density curable composition precursor, comprising (a) a first part (A) comprising: (i) at least one polymeric diamine; (b) a second part (B) comprising: (i) at least one epoxy resin; (ii) at least one reactive diluent; (iii) at least one amide selected from polyamide waxes; wherein part (A) and/or part (B) comprise a low density filler material having a density of less than 0.3 g/cc; and wherein the curable composition obtained by combining part (A) and part (B) has a cured density according to DIN 53479A of less than 0.5 g/cc.