Ultra-Slim Inline Board Connector for Low-EMF Thin Modules
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Solution Overview
Problem
Traditional solutions for connecting add-in boards to motherboards in slim computing devices result in unwanted electromagnetic frequency discharge and are costly to manufacture, limiting the z-dimension and complicating system compliance, especially in high-volume manufacturing.
Innovation Solution
The development of ultra slim module (USM) connectors, including inline and top mount USM connectors with a low profile, which use electrical leads and an alignment frame to secure add-in boards while minimizing height and reducing EMF discharge, allowing for efficient heat transfer and high-speed connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional connectors are used to connect add-in boards to motherboards, then electrical connection is achieved, but electromagnetic frequency discharge occurs and z-dimension is increased
Solution Approach 1:
The connector changes the physical parameters of the connection interface by using a low-profile design with reduced height (z-dimension), thereby minimizing electromagnetic frequency discharge while maintaining electrical connectivity between add-in boards and motherboards
Solution Approach 2:
The patent replaces traditional mechanical connector structures with an ultra-slim module design that eliminates the need for bulky connection mechanisms, thereby reducing both z-dimension and EMF discharge through a streamlined electrical lead configuration
2Ease of manufacture
If traditional connector solutions are used, then add-in boards can be connected, but manufacturing cost increases and manufacturing complexity increases
Solution Approach 1:
The ultra-slim module connector serves multiple functions including electrical connection, mechanical support, and alignment in a single integrated structure, eliminating the need for separate components and reducing manufacturing cost while simplifying the overall connector architecture
Solution Approach 2:
The patent merges the electrical leads, alignment features, and mechanical support structures into a single integrated ultra-slim module connector, thereby reducing manufacturing steps and complexity while maintaining connection functionality
3Adaptability or versatility
If add-in boards are connected to motherboards, then system functionality is enhanced, but electromagnetic interference compliance becomes difficult
Solution Approach 1:
The connector modifies the electromagnetic parameters by reducing the connection height and optimizing the electrical lead layout, thereby minimizing electromagnetic interference and improving compliance with EMC standards while maintaining system configuration flexibility
Data Source
AI summary
A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while aligned in substantially the same plane with an inline connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.