Ultra-Small Die Placement Using Laser Release Carriers
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Solution Overview
Problem
Current integrated circuit packaging technologies are inadequate for handling ultra-small and ultra-thin semiconductor dies due to physical limitations, high costs, inefficiency, and low production rates, making it difficult to package components with dimensions less than 50 µm in thickness or 300 µm in size.
Innovation Solution
The method involves temporarily attaching ultra-small and ultra-thin semiconductor dies to handle substrates, using a laser-assisted contactless transfer method and handle release layers to facilitate compatibility with standard electronics packaging equipment, enabling precise placement and handling of these components on device substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If standard electronics packaging equipment is used for ultra-small and ultra-thin semiconductor dies, then the existing systems can be utilized, but the components cannot be properly handled due to physical limitations
Solution Approach 1:
The patent introduces handle substrates as intermediary carriers that temporarily support ultra-small and ultra-thin semiconductor dies. These handle substrates act as mediators between the fragile components and standard packaging equipment, providing mechanical support that enables reliable handling while maintaining compatibility with existing pick-and-place systems. The handle substrates are subsequently removed after transfer, leaving the components properly positioned on the target substrate.
2Reliability
If specialized equipment is developed to handle ultra-small and ultra-thin components, then handling reliability improves, but manufacturing cost and system complexity increase
Solution Approach 1:
The patent segments the handling system into separate functional components: handle substrates for support, release layers for controlled detachment, and standard packaging equipment for transfer. This segmentation allows existing equipment to be used without modification while adding only the necessary support structures, thereby maintaining reliability without increasing overall system complexity.
3Manufacturing precision
If manual handling methods are used for ultra-small and ultra-thin components, then precision placement can be achieved, but production rate and efficiency decrease
Solution Approach 1:
The patent employs release layers with controlled adhesion properties that enable automatic detachment of handle substrates from the semiconductor dies through laser irradiation or other stimuli. This self-service mechanism eliminates the need for manual intervention in the detachment process, maintaining high placement precision while enabling automated high-speed production.
4Ease of manufacture
If conventional pick-and-place methods are used directly on ultra-small and ultra-thin dies, then the process remains simple, but production efficiency and output are limited
Solution Approach 1:
The patent applies preliminary action by pre-attaching semiconductor dies to handle substrates before the pick-and-place process. This preliminary support structure enables standard equipment to handle the components effectively, thereby maintaining process simplicity while significantly improving production efficiency and output rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the effective packaging of ultra-small and ultra-thin discrete components, enhancing production efficiency and reducing costs while ensuring compatibility with existing packaging systems, thereby expanding market capabilities for low-cost electronic devices.
Implementation Method 1
irradiating with a laser beam sufficient to heat the release layer and reduce adhesion between the semiconductor die and the handle substrate
Implementation Method 2
the bond between the discrete component and the handle substrate weakens
Implementation Method 3
emitting energy such that the bond between the discrete component and the handle substrate weakens
Data Source
Figure 1A~1B
Figure 2~3
Figure 4~5
AI summary
A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, the one of the discrete components being deposited onto a device substrate after the releasing.