Ultra-Thin Antireflection Sticker for Flexible Solar Cells

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing antireflection films for perovskite solar cells have a bilayer structure with a minimum thickness of 200 μm, making them unsuitable for high-efficiency flexible devices due to manufacturing constraints and mechanical stability issues.

Innovation Solution

A monolayer-structured ultra-thin antireflection sticker is manufactured using a soft lithography process, featuring semi-spherical antireflection structures and a thickness of about 20 μm, formed from perfluorinated polyether (PFPE) with a moth-eye type conical structure, allowing direct attachment to devices without additional bonding layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a bilayer structure antireflection film is manufactured using polydimethylsiloxane, then the manufacturing process is simple and material is easy to handle, but the minimum thickness is 200 μm which is too thick for high efficiency flexible devices

Engineering Contradiction:
Improveease of manufactureVSAvoidthickness
Core Design Contradiction:
Ease of manufactureVSLength of stationary object

Solution Approach 1:

The patent divides the traditional bilayer structure into a monolayer structure with integrated antireflection patterns, eliminating the need for multiple layers and reducing overall thickness from 200 μm to 20 μm while maintaining manufacturing simplicity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs a thin film structure with thickness of about 20 μm that maintains flexibility and adaptability for flexible devices, replacing the thick 200 μm bilayer structure while preserving ease of manufacture through soft lithography

Inventive Principle:
Principle #30Flexible shells and thin films

2Ease of manufacture

If a thick antireflection film is used, then manufacturing is easier with conventional processes, but mechanical stability deteriorates and application to flexible devices becomes difficult

Engineering Contradiction:
Improveease of manufactureVSAvoidmechanical stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent uses a thin film of about 20 μm thickness that provides excellent mechanical stability and flexibility, enabling successful application to flexible devices while maintaining ease of manufacture through the soft lithography process

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

By integrating the antireflection functionality into a single thin layer rather than using a thick bilayer structure, the patent achieves both mechanical stability and ease of manufacture in flexible device applications

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ultra-thin antireflection sticker enhances light transmittance and reduces reflectance, improving mechanical stability and photoelectric conversion efficiency of perovskite solar cells, particularly in flexible devices, with increased short circuit current density and durability under various conditions.

Implementation Method 1

a curing step in which the sticker material is cured

Methodology Applied
Scientific EffectUV curing: Photopolymerisation

Implementation Method 2

a thickness adjustment step in which the cured film presses the sticker material to adjust the thickness of the sticker material

Methodology Applied
Scientific EffectPressure application: Compression

Implementation Method 3

employs a structural optical effect through surface patterning

Methodology Applied
Scientific EffectStructural optical effect: Refraction

Data Source

PatentUS12534643B2Method of manufacturing ultra-thin antireflection sticker and ultra-thin antireflection sticker
Publication Date: 2026.01.27 THE IND & ACADEMIC COOP IN CHUNGNAM NAT UNIV (IAC)
  • US12534643B2 patent drawing
  • US12534643B2 patent drawing
  • US12534643B2 patent drawing

AI summary

A method of manufacturing a monolayer-structured ultra-thin antireflection sticker through a soft lithography process and an ultra-thin antireflection sticker, includes: a master mold manufacturing step in which a master mold having a plurality of semi-spherical mold structures on an upper surface thereof is manufactured; a sticker material coating step in which a sticker material is coated onto the upper surface of the master mold; a cured film covering step in which a cured film is disposed to cover an upper surface of the sticker material; a curing step in which the sticker material is cured; a cured film removal step in which the cured film is removed from the sticker material; and a sticker peeling step in which the cured sticker material is peeled off the master mold, the peeled-off sticker material forming a monolayer-structured ultra-thin antireflection sticker having a plurality of antireflective structures on an upper surface thereof.