Ultra-Thin Aluminum Electrolytic Capacitor Sealing for Low Height
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional solid aluminum electrolytic capacitors face challenges in thinning and miniaturization due to the thickness requirement of the rubber cover, which limits their height to 4.2 mm, restricting their application in certain scenarios and compromising heat resistance and shock resistance.
Innovation Solution
An ultra-thin solid aluminum electrolytic capacitor design where the cover and shell opening are integrally assembled by injection molding, forming a cover with a base plate, inner plug, and sealing side wall, reducing the thickness while maintaining heat resistance and shock resistance, and incorporating a flattened lead wire structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the rubber cover thickness is increased to meet airtightness and shock resistance requirements, then the heat resistance and shock resistance are improved, but the product height increases and cannot be thinned further
Solution Approach 1:
The patent merges the cover and base into a single integrated component made of heat-resistant and shock-resistant material. This unified structure eliminates the need for separate rubber cover and base components, achieving both heat resistance and shock resistance in one element while reducing overall height.
Solution Approach 2:
The patent employs composite materials with heat-resistant and shock-resistant properties for the integrated cover-base structure. This allows the single component to simultaneously provide thermal protection and mechanical shock resistance without requiring multiple layers or additional thickness.
2Length of moving object
If the rubber cover thickness is reduced to decrease product height, then the product can be thinned, but the airtightness and shock resistance are compromised
Solution Approach 1:
The patent combines the sealing function and shock resistance function into the integrated cover-base structure. The sealing side wall and flanged clamping portion are built into the same component, providing airtightness and shock resistance without requiring a separate thick rubber cover.
Solution Approach 2:
The patent uses a thin-film approach with the integrated cover structure that provides sealing and protection functions. The design achieves effective sealing and shock resistance with minimal thickness by optimizing the structural geometry rather than relying on material thickness alone.
3Ease of manufacture
If the traditional assembly method with separate rubber cover and base is used, then the manufacturing process is simple, but the product height is limited to 4.2 mm minimum
Solution Approach 1:
The patent merges two separate components (cover and base) into one integrated part. This eliminates the assembly step of attaching the base to the encapsulated capacitor body and reduces the minimum height from 4.2 mm to 3.0 mm by removing the interface and overlapping structures between components.
Solution Approach 2:
While merging components, the patent maintains functional segmentation within the integrated structure through distinct features like the sealing side wall, flanged clamping portion, and groove structures. This allows complex functionality to be achieved in a single component without sacrificing manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a total height of less than 3.0 mm, enhancing sealing, reflow soldering thermal stress resistance, and shock resistance, while simplifying manufacturing and expanding application ranges.
Implementation Method 1
the cover is formed by filling a cavity between the opening of the case and the element with a molten plastic, and solidification
Data Source
AI summary
An ultra-thin solid aluminum electrolytic capacitor includes a case, an element, and a cover. A side of the case is provided with an opening. A flanged clamping portion is provided at the opening. The cover is embedded inside the opening through injection molding to encapsulate the element in the case. The cover includes a base plate, an inner plug, and a sealing side wall. The sealing side wall and the inner plug are vertically provided at an upper end face of the base plate. The inner plug is located at an inner side of the sealing side wall. A gap between an outer peripheral wall of the inner plug and an inner peripheral wall of the sealing side wall forms a groove communicated with the opening. An end face of the inner plug is symmetrically provided with two lead holes.