Ultra-Thin Ceramic Data Carrier for Dense Archival Storage
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Solution Overview
Problem
Existing data carriers for long-term storage, such as ceramic substrates with a thickness of 1 mm, do not achieve optimal data storage densities and are mechanically less stable, posing challenges for flexible handling and encoding.
Innovation Solution
Utilizing thin films of glass ceramic or glass substrates with recesses encoding information, and optionally coated with materials like metal nitrides, carbides, or oxides, to enhance data storage density and mechanical flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic substrates with thickness of 1 mm are used for long-term data storage, then resistance to moisture and corrosive substances is improved, but data storage density per volume deteriorates
Solution Approach 1:
The patent applies this principle by transitioning from thick rigid ceramic substrates (1 mm) to thin ceramic films (at most 200 μm, preferably at most 150 μm). This thin-film approach maintains the protective barrier function against moisture and corrosive substances while dramatically reducing volume, thereby increasing data storage density per volume by a factor of at least 6.
2Strength
If ceramic substrates with thickness of 1 mm are used, then mechanical stability is improved, but data storage density per volume deteriorates
Solution Approach 1:
The patent employs thin ceramic films (at most 200 μm) that balance mechanical stability with reduced volume. The film thickness is optimized to provide sufficient structural integrity for handling while enabling the volume reduction necessary for high-density data storage.
Solution Approach 2:
The patent uses composite structures combining ceramic films with coating layers. The ceramic film provides mechanical stability and environmental resistance, while the coating layers (applied via sputtering, evaporation, or CVD) provide additional protective and functional properties, creating a multi-layer composite that achieves both mechanical strength and high storage density.
3Quantity of substance
If thin ceramic films with thickness of at most 200 μm are used, then data storage density per volume is improved, but mechanical stability deteriorates
Solution Approach 1:
The patent compensates for the reduced mechanical stability of thin ceramic films by applying multiple coating layers through vacuum deposition techniques (sputtering, evaporation, CVD). These coatings create a composite structure where the combined system maintains adequate mechanical stability while the thin film enables high data storage density.
Solution Approach 2:
The patent optimizes the thickness parameter of the ceramic film to at most 200 μm (preferably at most 150 μm), which represents a critical threshold that balances volume reduction for high storage density with maintaining sufficient mechanical stability for practical handling and application.
4Manufacturing precision
If recesses with depth of at most 1 μm are used in thin substrates, then data storage precision is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces traditional mechanical or chemical etching methods with laser beam technology to create recesses in the thin ceramic film. This substitution enables precise control of recess depth (at most 1 μm) and geometry without requiring complex multi-step manufacturing processes, thereby achieving high encoding precision while managing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thin substrates increase data storage density by a factor of 6 and maintain high resistance to moisture and corrosive substances, allowing flexible handling and reliable optical decoding.
Implementation Method 1
the first surface of the substrate comprises a plurality of recesses encoding information... These recesses may be generated by means of a laser beam
Data Source
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AI summary
The present invention relates to an ultra-thin data carrier for long-term data conservation.