Ultra-thin Copper Foil Carrier Dual Release Layer Blistering
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Solution Overview
Problem
The ultra-thin copper foil with a carrier experiences unstable peeling strength and is prone to blistering, especially when exposed to high temperatures, making it difficult to maintain consistent carrier peeling in both width and length directions.
Innovation Solution
The ultra-thin copper foil with a carrier features a dual release layer system, where the first release layer is on the carrier foil side and the second release layer is on the copper foil side, with specific metal compositions and ratios to control peeling strengths at different interfaces, and an oxide layer is formed at the third interface to stabilize peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single release layer is used in ultra-thin copper foil with carrier, then the structure is simple and manufacturing is easier, but the peeling strength becomes unstable and blistering occurs at high temperatures
Solution Approach 1:
The release layer is divided into two distinct layers: a first release layer (metal oxide layer) and a second release layer (metal foil layer). This segmentation allows each layer to perform its specific function - the metal oxide layer provides stable peeling strength and prevents blistering, while the metal foil layer facilitates easy peeling and provides mechanical support. The segmentation resolves the contradiction by achieving reliable peeling through structural division rather than using a single complex layer.
Solution Approach 2:
The invention uses a composite release layer structure combining metal oxide and metal foil materials. The metal oxide layer (such as ZnO, Al2O3, or TiO2) provides thermal stability and controlled peeling strength, while the metal foil layer (such as Cu, Ni, or Cr) provides ductility and support. This composite structure resolves the contradiction between simplicity and reliability by leveraging the complementary properties of different materials.
2Ease of operation
If the release layer peeling strength is made low for easy carrier removal, then carrier peeling becomes easier, but blistering occurs and peeling stability deteriorates
Solution Approach 1:
The release layer system exhibits local quality differentiation where the metal oxide layer has high peeling strength to prevent blistering and maintain stability, while the metal foil layer has lower peeling strength to facilitate easy carrier removal. This local quality distribution resolves the contradiction by having different regions of the release layer serve different functions - one region ensures stability while another enables ease of operation.
3Manufacturing precision
If ultra-thin copper foil thickness is reduced to 5 μm or less for fine pattern applications, then line width and spacing can be reduced to 30 μm, but mechanical strength decreases and wrinkles and creases occur
Solution Approach 1:
The ultra-thin copper foil is nested on the metal foil carrier with the release layer in between, creating a layered structure where the thin copper layer (5 μm or less) provides fine pattern capability while the thicker metal foil carrier provides mechanical strength and support. This nesting resolves the contradiction by allowing the thin copper foil to achieve fine interconnect patterns while the carrier prevents wrinkles and creases during handling and processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the carrier peel, prevents blistering, and allows for easy peeling of the carrier foil from the copper foil even at high temperatures, ensuring reliable production of copper-clad laminate boards for fine pattern applications.
Implementation Method 1
a first release layer formed by electroplating of a metal A on the carrier foil (2), and a second release layer formed by electroplating of a metal B on the copper foil (1)
Implementation Method 2
the third interface (6) is an oxide layer obtained by applying an oxidation treatment to a surface of the first release layer (3)
Data Source
AI summary
The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface>third interface, and second interface>third interface.