Ultra Thin Die Electronic Package With Polymer Adhesive Interconnects
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Solution Overview
Problem
Existing electronic packaging technologies face challenges in handling and connecting ultra-thin dies due to the rigidity of substrates and the need for encapsulating wire bonds, which increases assembly height and limits flexibility.
Innovation Solution
A method involving the use of polymer films and adhesive layers on substrates with metallized vias to form ultra-thin die electronic packages, allowing for the embedding of thin dies between substrates and creating flexible interconnects through drilling or etching, enabling direct laser via interconnects and reducing overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonds are used for electrical connection, then electrical connectivity is achieved, but assembly height and overall volume increase due to encapsulation requirements
Solution Approach 1:
The patent extracts and eliminates the wire bond component from the interconnection system, replacing it with direct substrate-to-substrate bonding. This removes the need for wire bond encapsulation, thereby reducing assembly height while maintaining electrical connectivity through the adhesive layer and substrate metallization.
Solution Approach 2:
The patent transitions from three-dimensional wire bond routing to a planar, two-dimensional bonding interface between substrates. By establishing electrical connections through the adhesive layer plane rather than through vertical wire bonds, the assembly height is reduced while connectivity is maintained.
2Strength
If rigid PCB boards are used as substrates, then structural support is provided, but flexibility and physical adaptability of the assembly are reduced
Solution Approach 1:
The patent replaces rigid PCB substrates with flexible thin-film substrates that can bend and conform to various shapes. These thin-film substrates maintain sufficient structural support for the electronic components while enabling the assembly to be flexible and adaptable to different form factors and mounting surfaces.
Solution Approach 2:
The patent changes the physical parameters of the substrate by transitioning from rigid, thick PCB material to flexible, thin-film material. This parameter change in substrate thickness and material properties simultaneously reduces the substrate's rigidity (enabling flexibility) while maintaining adequate structural support for the electronic components.
3Volume of moving object
If die thickness is reduced to minimize package size, then compactness is improved, but handling and connection difficulty increases
Solution Approach 1:
The patent merges the die with the substrate by directly bonding the thinned die to the thin-film substrate using the adhesive layer. This integration creates a unified, robust structure where the die and substrate support each other, making the ultra-thin die easier to handle and connect despite its reduced thickness.
Solution Approach 2:
The patent performs preliminary thinning of the die to the desired ultra-thin dimension before the bonding process. By pre-thinning the die and preparing the bonding surfaces in advance, the subsequent handling and connection processes are simplified, and the die is already in its final compact form ready for integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a lightweight, flexible, and compact electronic package suitable for microelectronics and wearable devices, offering improved handling and connectivity while maintaining a thin profile.
Implementation Method 1
applying an adhesive layer to the polymer film... attaching the first substrate and the at least one additional substrate with the adhesive layer
Implementation Method 2
forming an electrical interconnection between the first substrate, the at least one additional substrate and a die pad of the at least one die... metallized vias
Data Source
AI summary
A method for forming an ultra thin die electronic package includes disposing a first polymer film on a first substrate, applying a first adhesive layer to the first polymer film, disposing at least one die on the first adhesive layer, disposing a second polymer film on at least one additional substrate, applying a second adhesive layer to the second polymer film on at least one additional substrate, applying a second adhesive layer to the second polymer film, and attaching the first substrate and the at least one additional substrate via the first adhesive layer and the second adhesive layer such that the at least one die is interspersed between. The method also includes forming multiple vias on a top and/or bottom side of the first and the additional substrate(s), wherein the multiple vias are directly connected to the die, and forming an electrical interconnection between the first substrate, the at least one additional substrate and a die pad of the at least one die.